Details

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BUY 9LRS3165BGLFT https://www.utsource.net/itm/p/12402858.html

Parameter	Value	Unit
Part Number	9LRS3165BGLFT
Package Type	BGA
Pin Count	256
Operating Temperature	-40 to 125	掳C
Supply Voltage (Vcc)	1.8 to 3.6	V
I/O Voltage (Vio)	1.2 to 3.6	V
Maximum Clock Frequency	200	MHz
Data Width	16-bit
Memory Size	16 Mb
Access Time	15	ns
Standby Current	10	渭A
Active Current	50	mA
Write Cycle Time	50	ns
Package Material	Lead-Free
RoHS Compliant	Yes

Instructions for Use

1. Power Supply:

   • Ensure that the supply voltage (Vcc) is within the range of 1.8V to 3.6V.
   • The I/O voltage (Vio) should be set between 1.2V and 3.6V.

2. Temperature Range:

   • Operate the device within the temperature range of -40掳C to 125掳C to ensure reliable performance.

3. Clock Frequency:

   • The maximum clock frequency is 200 MHz. Ensure that the clock signal is stable and within this limit.

4. Data Handling:

   • The device supports a 16-bit data width. Configure the data lines accordingly.

5. Memory Operations:

   • The memory size is 16 Mb. Use the appropriate commands to read from and write to the memory.
   • The access time is 15 ns, and the write cycle time is 50 ns. Ensure that your system timing meets these requirements.

6. Current Consumption:

   • In standby mode, the current consumption is 10 渭A.
   • In active mode, the current consumption can reach up to 50 mA.

7. Package Handling:

   • The device uses a BGA package with 256 pins. Handle the package carefully to avoid damage to the solder balls.
   • The package is lead-free and RoHS compliant.

8. Soldering and Mounting:

   • Follow standard BGA soldering guidelines to ensure proper mounting on the PCB.
   • Use a reflow soldering process with appropriate temperature profiles to avoid thermal stress.

9. Testing and Verification:

   • After mounting, perform functional tests to verify the correct operation of the device.
   • Check for any shorts or open circuits in the power and ground connections.

10. Storage:

    • Store the device in a dry, cool environment to prevent moisture damage.
    • Use anti-static packaging to protect the device from electrostatic discharge (ESD).

(For reference only)