Details

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BUY MC74VHC08DTR2G https://www.utsource.net/itm/p/12403149.html

Parameter	Symbol	Min	Typ	Max	Unit
Supply Voltage	VCC	2.0	-	6.0	V
Input Low Voltage	VIL	-	-	1.5	V
Input High Voltage	VIH	3.5	-	-	V
Output Low Voltage	VOL	-	0.1	0.4	V
Output High Voltage	VOH	2.4	-	VCC-0.5	V
Propagation Delay Time	tpd	-	12	25	ns
Power Dissipation	Ptot	-	-	350	mW
Operating Temperature Range	TA	-40	-	85	°C
Storage Temperature Range	TSTG	-65	-	150	°C

Instructions for Use:

1. Supply Voltage (V_CC):

   • Ensure the supply voltage is within the range of 2.0V to 6.0V.
   • Avoid exceeding the maximum supply voltage to prevent damage to the device.

2. Input Voltage Levels:

   • Input low voltage (V_IL) should be less than or equal to 1.5V.
   • Input high voltage (V_IH) should be greater than or equal to 3.5V.
   • Inputs should not exceed the supply voltage (V_CC).

3. Output Voltage Levels:

   • Output low voltage (V_OL) will typically be around 0.1V to 0.4V.
   • Output high voltage (V_OH) will be at least 2.4V and can go up to V_CC - 0.5V.

4. Propagation Delay Time (t_pd):

   • The typical propagation delay time is 12ns, with a maximum of 25ns.
   • This parameter is crucial for timing considerations in your circuit design.

5. Power Dissipation (P_tot):

   • The total power dissipation should not exceed 350mW to avoid overheating and potential damage to the device.

6. Operating Temperature (T_A):

   • The device is designed to operate within a temperature range of -40°C to 85°C.
   • Ensure the ambient temperature does not exceed these limits during operation.

7. Storage Temperature (T_STG):

   • When storing the device, keep it within a temperature range of -65°C to 150°C to maintain its integrity.

8. Handling and ESD Protection:

   • Handle the device with care to avoid static discharge, which can damage the internal circuits.
   • Use proper ESD protection measures when handling and soldering the device.

9. Mounting and Soldering:

   • Follow recommended soldering profiles and temperatures to ensure reliable mounting on the PCB.
   • Avoid excessive heat and mechanical stress during the soldering process.

(For reference only)