Details

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BUY HIN211ECAZ-T https://www.utsource.net/itm/p/12403904.html

Parameter	Description	Min	Typ	Max	Unit
Supply Voltage (VDD)	Operating voltage range	4.5	-	5.5	V
Output Current (IO)	Maximum output current per channel	-	100	-	mA
Channel-to-Channel Crosstalk	Signal isolation between channels	-	-	60	dB
Operating Temperature (Tamb)	Ambient temperature range	-40	-	85	°C
Storage Temperature (Tstg)	Storage temperature range	-65	-	150	°C
Input Capacitance (Cin)	Capacitance at input pins	-	10	-	pF
Output Capacitance (Cout)	Capacitance at output pins	-	10	-	pF
Propagation Delay (tpd)	Time delay from input to output	-	10	-	ns
Power Dissipation (Pd)	Maximum power dissipation	-	-	1000	mW

Instructions for Using HIN211ECAZ-T

1. Power Supply:

   • Ensure the supply voltage (VDD) is within the specified range of 4.5V to 5.5V.
   • Connect the ground (GND) pin to a stable ground reference.

2. Signal Inputs:

   • Apply input signals to the designated input pins.
   • Ensure input capacitance does not exceed 10 pF to maintain signal integrity.

3. Output Connections:

   • Connect the output pins to the load or subsequent stages.
   • Do not exceed the maximum output current of 100 mA per channel to avoid damage.

4. Temperature Considerations:

   • Operate the device within the ambient temperature range of -40°C to 85°C.
   • Store the device within the storage temperature range of -65°C to 150°C.

5. Signal Isolation:

   • Channels are isolated with a crosstalk of up to 60 dB to minimize interference between channels.

6. Propagation Delay:

   • The typical propagation delay is 10 ns. Account for this delay in timing-sensitive applications.

7. Power Dissipation:

   • Ensure the total power dissipation does not exceed 1000 mW to prevent overheating and potential damage.

8. Handling Precautions:

   • Handle the device with care to avoid static discharge.
   • Use appropriate ESD protection measures during handling and installation.

9. Mounting:

   • Mount the device on a PCB with proper thermal management if high power dissipation is expected.
   • Follow recommended PCB layout guidelines for optimal performance.

(For reference only)