Details

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BUY EUP3482ADIR1 https://www.utsource.net/itm/p/12404287.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Supply Voltage	VCC	4.5	-	5.5	V	Operating supply voltage range
Output Current	IOUT	-	1.0	1.5	A	Continuous output current
Switching Frequency	fSW	-	650	-	kHz	Typical switching frequency
Efficiency	畏	-	90	-	%	Typical efficiency at nominal load
Shutdown Current	ISD	-	1	-	渭A	Quiescent current in shutdown mode
Thermal Shutdown Temperature	TSD	-	160	-	掳C	Temperature at which thermal shutdown occurs
Operating Junction Temperature	TJ	-40	-	125	掳C	Range of operating junction temperatures
Storage Temperature	TSTG	-65	-	150	掳C	Range of storage temperatures

Instructions for Use:

1. Supply Voltage (V_CC):

   • Ensure the supply voltage is within the range of 4.5V to 5.5V to avoid damage or malfunction.

2. Output Current (I_OUT):

   • The device can provide a continuous output current of up to 1.5A. Avoid exceeding this limit to prevent overheating and potential damage.

3. Switching Frequency (f_SW):

   • The typical switching frequency is 650kHz. This is optimized for efficient operation and minimal electromagnetic interference (EMI).

4. Efficiency (畏):

   • The typical efficiency is 90% at nominal load conditions. Monitor the efficiency to ensure optimal performance.

5. Shutdown Current (I_SD):

   • When the device is in shutdown mode, the quiescent current is approximately 1渭A. Use the shutdown feature to conserve power when not in use.

6. Thermal Shutdown (T_SD):

   • The device will automatically shut down if the junction temperature reaches 160掳C to prevent thermal damage. Ensure proper heat dissipation and cooling.

7. Operating Junction Temperature (T_J):

   • The operating junction temperature range is from -40掳C to 125掳C. Ensure the device operates within this range to maintain reliability.

8. Storage Temperature (T_STG):

   • Store the device in an environment with temperatures ranging from -65掳C to 150掳C to prevent degradation.

Additional Notes:

• Always refer to the datasheet for detailed specifications and application notes.
• Use appropriate PCB layout techniques to minimize noise and improve thermal performance.
• For high-power applications, consider using external heatsinks or cooling solutions.

(For reference only)