Details

---

BUY HY3708P 80V170A REPLACEABLE IRFB3307ZPBF IRF1607 IRF3808 https://www.utsource.net/itm/p/12405479.html

Parameter	HY3708P (80V170A) REPLACEABLE IRFB3307ZPBF IRF1607 IRF3808
Absolute Maximum Ratings
Drain-Source Voltage (VDS)	80V
Gate-Source Voltage (VGS)	±20V
Continuous Drain Current (ID)	170A at TC = 25°C
Pulse Drain Current (IDM)	400A (t = 10μs, Duty Cycle = 1%)
Power Dissipation (PD)	210W at TC = 25°C
Junction Temperature (TJ)	-55°C to +175°C
Storage Temperature (TSTG)	-55°C to +175°C
Electrical Characteristics
Input Capacitance (Ciss)	5950pF (VDS = 20V, f = 1MHz)
Output Capacitance (Coss)	850pF (VDS = 20V, f = 1MHz)
Reverse Transfer Capacitance (Crss)	1100pF (VDS = 20V, f = 1MHz)
Threshold Voltage (VGS(th))	4.0V (ID = 250μA, VDS = 10V)
RDS(on) @ VGS = 10V	3.5mΩ (TC = 25°C)
Physical Characteristics
Package Type	TO-247
Pin Configuration	D2PAK (Drain, Source, Gate)

Instructions for Use:

1. Mounting and Handling:

   • Ensure the device is mounted on a suitable heatsink to manage heat dissipation effectively.
   • Handle with care to avoid damage to the pins and body.

2. Power Supply Considerations:

   • Ensure that the power supply voltage does not exceed the maximum drain-source voltage (VDS).
   • Implement proper protection circuits such as flyback diodes if switching inductive loads.

3. Gate Drive Requirements:

   • Provide sufficient gate drive voltage to fully turn on the MOSFET and minimize conduction losses.
   • Keep gate drive signals clean to prevent false triggering.

4. Thermal Management:

   • Monitor the junction temperature to ensure it stays within operational limits.
   • Use thermal paste between the MOSFET and heatsink for better thermal conductivity.

5. Storage:

   • Store in a dry environment away from direct sunlight and sources of heat.
   • Follow anti-static precautions when handling to prevent damage from ESD.

6. Replacement Guidelines:

   • When replacing with equivalent models like IRFB3307ZPBF, IRF1607, or IRF3808, verify that all parameters match or exceed those of the original part.
   • Cross-check pin configurations and package types to ensure compatibility.

(For reference only)