Details

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BUY M50100SB400 https://www.utsource.net/itm/p/12426391.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Input Voltage	VIN	4.5	-	28	V	Operating input voltage range
Output Voltage	VOUT	3.3	-	5.0	V	Adjustable output voltage
Output Current	IOUT	-	400	-	mA	Maximum continuous output current
Efficiency	η	-	90	-	%	Typical efficiency at nominal load
Dropout Voltage	VDROPOUT	-	0.4	-	V	Typical dropout voltage at 400mA
Quiescent Current	IQ	-	1.5	-	mA	Quiescent current at no load
Load Regulation	-	-	0.2	-	%	Change in output voltage with load
Line Regulation	-	-	0.1	-	%/V	Change in output voltage with input
Ripple Rejection	-	-	60	-	dB	Attenuation of input ripple
Operating Temperature	TOPR	-40	-	125	°C	Operating temperature range
Storage Temperature	TSTG	-65	-	150	°C	Storage temperature range

Instructions for Use:

1. Input Connection:

   • Connect the input voltage (VIN) to the positive terminal of the power supply.
   • Ensure the input voltage is within the specified range (4.5V to 28V).

2. Output Connection:

   • Connect the output voltage (VOUT) to the load.
   • Adjust the output voltage if necessary using the external resistor network.

3. Ground Connection:

   • Connect the ground (GND) of the power supply, load, and M50100SB400 together to ensure proper operation.

4. Heat Dissipation:

   • Ensure adequate heat dissipation, especially when operating at high output currents or in high ambient temperatures.
   • Consider using a heatsink if the device is expected to operate near its maximum output current.

5. Capacitors:

   • Use input and output capacitors as recommended in the datasheet to stabilize the circuit and reduce ripple.
   • Typical values are 10μF for the input and 10μF for the output.

6. PCB Layout:

   • Follow good PCB layout practices to minimize noise and parasitic effects.
   • Keep the input and output traces short and wide.

7. Protection:

   • The device includes internal protection features such as overcurrent and thermal shutdown.
   • However, it is advisable to include additional protection circuits (e.g., fuses, diodes) for robustness in critical applications.

8. Storage:

   • Store the device in a dry, cool place within the specified storage temperature range (-65°C to 150°C).

9. Handling:

   • Handle the device with care to avoid damage from electrostatic discharge (ESD).
   • Use ESD-safe tools and work surfaces when handling the device.

(For reference only)