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Parameter | Description | Min | Typ | Max | Unit |
---|---|---|---|---|---|
Supply Voltage (Vcc) | Operating supply voltage | 4.5 | - | 5.5 | V |
Quiescent Current (Iq) | Current consumption in standby mode | - | 100 | - | μA |
Output Current (Iout) | Maximum output current per channel | - | 250 | - | mA |
Operating Temperature (Tamb) | Ambient operating temperature range | -40 | - | 125 | °C |
Storage Temperature (Tstg) | Storage temperature range | -65 | - | 150 | °C |
Thermal Shutdown (TSD) | Thermal shutdown threshold | - | 160 | - | °C |
Output Short-Circuit Protection | Protection against short circuits | Yes | - | - | - |
Overvoltage Protection | Protection against overvoltage conditions | Yes | - | - | - |
Reverse Battery Protection | Protection against reverse battery connection | Yes | - | - | - |
Instructions for Use:
Supply Voltage:
- Ensure the supply voltage is within the range of 4.5V to 5.5V to avoid damage to the device.
Quiescent Current:
- The device consumes approximately 100 μA in standby mode. This should be considered in power budget calculations.
Output Current:
- Each output channel can provide up to 250 mA. Do not exceed this limit to prevent overheating and potential damage.
Operating Temperature:
- The device operates reliably between -40°C and 125°C ambient temperatures. Ensure adequate cooling if used in high-temperature environments.
Storage Temperature:
- Store the device between -65°C and 150°C to maintain its performance and reliability.
Thermal Shutdown:
- The device will automatically shut down if the temperature exceeds 160°C to prevent damage. Allow the device to cool before resuming operation.
Protection Features:
- The device includes output short-circuit protection, overvoltage protection, and reverse battery protection. These features help ensure safe operation under various fault conditions.
Layout Considerations:
- Use proper PCB layout techniques to minimize electromagnetic interference (EMI) and ensure stable operation. Keep power and ground traces short and wide.
Mounting:
- Mount the device on a heatsink or a PCB with good thermal conductivity if it will be operating at high currents or in high-temperature environments.
Testing:
- Before deploying the device in a final application, perform thorough testing to ensure all parameters are within specified limits and that the device functions as expected.
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