ATA6836C-TIQW

ATA6836C-TIQW


Specifications
SKU
12426770
Details

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Parameter Description Min Typ Max Unit
Supply Voltage (Vcc) Operating supply voltage 4.5 - 5.5 V
Quiescent Current (Iq) Current consumption in standby mode - 100 - μA
Output Current (Iout) Maximum output current per channel - 250 - mA
Operating Temperature (Tamb) Ambient operating temperature range -40 - 125 °C
Storage Temperature (Tstg) Storage temperature range -65 - 150 °C
Thermal Shutdown (TSD) Thermal shutdown threshold - 160 - °C
Output Short-Circuit Protection Protection against short circuits Yes - - -
Overvoltage Protection Protection against overvoltage conditions Yes - - -
Reverse Battery Protection Protection against reverse battery connection Yes - - -

Instructions for Use:

  1. Supply Voltage:

    • Ensure the supply voltage is within the range of 4.5V to 5.5V to avoid damage to the device.
  2. Quiescent Current:

    • The device consumes approximately 100 μA in standby mode. This should be considered in power budget calculations.
  3. Output Current:

    • Each output channel can provide up to 250 mA. Do not exceed this limit to prevent overheating and potential damage.
  4. Operating Temperature:

    • The device operates reliably between -40°C and 125°C ambient temperatures. Ensure adequate cooling if used in high-temperature environments.
  5. Storage Temperature:

    • Store the device between -65°C and 150°C to maintain its performance and reliability.
  6. Thermal Shutdown:

    • The device will automatically shut down if the temperature exceeds 160°C to prevent damage. Allow the device to cool before resuming operation.
  7. Protection Features:

    • The device includes output short-circuit protection, overvoltage protection, and reverse battery protection. These features help ensure safe operation under various fault conditions.
  8. Layout Considerations:

    • Use proper PCB layout techniques to minimize electromagnetic interference (EMI) and ensure stable operation. Keep power and ground traces short and wide.
  9. Mounting:

    • Mount the device on a heatsink or a PCB with good thermal conductivity if it will be operating at high currents or in high-temperature environments.
  10. Testing:

    • Before deploying the device in a final application, perform thorough testing to ensure all parameters are within specified limits and that the device functions as expected.
(For reference only)

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