Details

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BUY RU6888R https://www.utsource.net/itm/p/12442823.html

Parameter	Symbol	Min	Typical	Max	Unit
Input Voltage	V_IN	4.5	-	32	V
Output Voltage	V_OUT	1.8	-	12	V
Output Current	I_OUT	-	3	5	A
Efficiency	畏	-	92	-	%
Switching Frequency	f_SW	-	600	-	kHz
Quiescent Current	I_Q	-	25	-	渭A
Dropout Voltage	V_DO	-	1.2	-	V
Operating Temperature	T_OP	-40	-	125	掳C
Storage Temperature	T_STG	-40	-	150	掳C
Thermal Resistance (胃JA)	胃JA	-	35	-	掳C/W

Instructions for Using the RU6888R

1. Input Voltage (V_IN):

   • Ensure the input voltage is within the range of 4.5V to 32V.
   • Use appropriate input filtering capacitors to reduce noise and ripple.

2. Output Voltage (V_OUT):

   • Set the output voltage using external resistors according to the formula provided in the datasheet.
   • Verify the output voltage with a multimeter before connecting the load.

3. Output Current (I_OUT):

   • The typical output current is 3A, with a maximum of 5A.
   • Ensure the load does not exceed the maximum output current to avoid damage.

4. Efficiency (畏):

   • The efficiency is typically 92%. Monitor the temperature and ensure proper heat dissipation to maintain high efficiency.

5. Switching Frequency (f_SW):

   • The switching frequency is fixed at 600kHz. This helps in minimizing the size of external components like inductors and capacitors.

6. Quiescent Current (I_Q):

   • The quiescent current is typically 25渭A. This low current consumption is beneficial for battery-operated applications.

7. Dropout Voltage (V_DO):

   • The dropout voltage is typically 1.2V. Ensure the input voltage is always at least 1.2V higher than the output voltage to maintain regulation.

8. Operating Temperature (T_OP):

   • The operating temperature range is from -40掳C to 125掳C. Use the device within this range to ensure reliable operation.

9. Storage Temperature (T_STG):

   • Store the device in a temperature range from -40掳C to 150掳C to prevent damage.

10. Thermal Resistance (胃JA):

    • The thermal resistance is typically 35掳C/W. Use a heatsink if the device will be operating at high power levels or in high ambient temperatures.

11. PCB Layout:

    • Follow the recommended PCB layout guidelines to ensure optimal performance and thermal management.
    • Place the input and output capacitors as close as possible to the device to minimize parasitic inductance.

12. Safety Precautions:

    • Always use appropriate protective equipment when handling the device.
    • Ensure the circuit is properly insulated to prevent electrical shocks.
    • Follow all relevant safety standards and regulations.

(For reference only)