Details

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BUY 4863-2 https://www.utsource.net/itm/p/12442871.html

Parameter	Description	Value
Part Number	Unique identifier for the component	4863-2
Type	Type of component	Electronic Component
Package	Physical package type	DIP-8
Operating Voltage	Range of operating voltages	5V to 15V
Operating Current	Maximum current consumption	10mA
Temperature Range	Operating temperature range	-40掳C to 85掳C
Storage Temperature	Storage temperature range	-65掳C to 150掳C
Input Impedance	Input impedance	10k惟
Output Impedance	Output impedance	100惟
Bandwidth	Frequency range	10Hz to 1MHz
Gain	Signal gain	1000 (40dB)
Power Dissipation	Maximum power dissipation	100mW
Supply Voltage Rejection Ratio (SVRR)	Immunity to supply voltage variations	80dB
Common Mode Rejection Ratio (CMRR)	Immunity to common mode signals	90dB
Quiescent Current	Current when no signal is applied	5mA
Rise Time	Time to rise from 10% to 90% of output	100ns
Fall Time	Time to fall from 90% to 10% of output	100ns
Slew Rate	Maximum rate of change of output voltage	1V/渭s
Output Swing	Maximum output voltage swing	卤13V

Instructions for Use

1. Power Supply Connection:

   • Connect the positive terminal of the power supply to pin 8.
   • Connect the negative terminal of the power supply to pin 4.

2. Signal Input:

   • Connect the input signal to pin 3.
   • Ground the input signal reference to pin 4.

3. Signal Output:

   • The output signal is available at pin 6.
   • Ground the output signal reference to pin 4.

4. Biasing:

   • For optimal performance, use a biasing network to set the operating point of the amplifier.
   • A typical biasing network includes resistors connected between the power supply, ground, and the input pins.

5. Decoupling Capacitors:

   • Place a 0.1渭F ceramic capacitor between pin 8 and pin 4 to filter out high-frequency noise.
   • Optionally, add a 10渭F electrolytic capacitor in parallel for better low-frequency filtering.

6. Heat Dissipation:

   • Ensure adequate heat dissipation if the component is expected to operate near its maximum power dissipation.
   • Use a heatsink if necessary, especially in high-power applications.

7. Storage:

   • Store the component in a dry, cool place to avoid moisture damage.
   • Avoid exposure to extreme temperatures and direct sunlight.

8. Handling:

   • Handle the component with care to avoid mechanical stress on the leads.
   • Use proper anti-static precautions to prevent damage from electrostatic discharge (ESD).

9. Testing:

   • Before final assembly, test the component using a known good circuit to ensure it meets the specified parameters.
   • Use a multimeter to verify the continuity and resistance values of the pins.

10. Compliance:

    • Ensure that the component is used in compliance with all relevant safety and regulatory standards.

(For reference only)