Details

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BUY AT29C010A-70JU https://www.utsource.net/itm/p/12443317.html

Parameter	Symbol	Min	Typical	Max	Unit	Notes
Supply Voltage	Vcc	2.7	-	6.0	V
Standby Current	ISB	-	1.0	2.0	μA	Vcc = 5V, TA = 25°C
Active Current	IAV	-	10	20	mA	Vcc = 5V, TA = 25°C
Programming Current	IPGM	10	-	25	mA	Vcc = 5V, TA = 25°C
Erase/Program Cycle Time	TPC	-	4	8	s	Vcc = 5V, TA = 25°C
Data Retention		10	-	100	years	Vcc = 5V, TA = 25°C
Operating Temperature	TA	-40	-	85	°C
Storage Temperature	TSTG	-65	-	150	°C
Output High Voltage	VOH	2.4	-	Vcc-0.4	V	IOL = -0.4mA, Vcc = 5V, TA = 25°C
Output Low Voltage	VOL	-	0.4	0.5	V	IOH = 4.0mA, Vcc = 5V, TA = 25°C
Input High Voltage	VIH	2.0	-	Vcc	V	IIH = 1.0μA, Vcc = 5V, TA = 25°C
Input Low Voltage	VIL	0	-	0.8	V	IIL = 1.0μA, Vcc = 5V, TA = 25°C
Access Time	tAC	70	-	90	ns	Vcc = 5V, TA = 25°C
Address Setup Time	tAS	20	-	30	ns	Vcc = 5V, TA = 25°C
Address Hold Time	tAH	0	-	5	ns	Vcc = 5V, TA = 25°C
Output Enable Setup Time	tOE	20	-	30	ns	Vcc = 5V, TA = 25°C
Output Enable Hold Time	tOH	0	-	5	ns	Vcc = 5V, TA = 25°C
Write Enable Setup Time	tWE	20	-	30	ns	Vcc = 5V, TA = 25°C
Write Enable Hold Time	tWH	0	-	5	ns	Vcc = 5V, TA = 25°C

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (Vcc) is within the specified range of 2.7V to 6.0V.
   • The device has a low standby current, making it suitable for battery-powered applications.

2. Programming:

   • The programming current (IPGM) should be between 10mA and 25mA.
   • The typical time required for a complete erase/program cycle is 4 seconds, with a maximum of 8 seconds.

3. Temperature:

   • The operating temperature range is from -40°C to 85°C.
   • The storage temperature range is from -65°C to 150°C.

4. Timing Parameters:

   • Ensure that all timing parameters such as access time (tAC), address setup time (tAS), and output enable setup time (tOE) are met to avoid data corruption or incorrect operation.

5. Data Retention:

   • The device guarantees data retention for at least 10 years under normal operating conditions.

6. Handling:

   • Handle the device with care to avoid static discharge, which can damage the chip.
   • Follow proper soldering techniques to ensure reliable connections.

7. Testing:

   • Before deploying the device in a final application, test it under various conditions to ensure it meets the required performance specifications.

(For reference only)