Details

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BUY GAL20RA10B-20LP https://www.utsource.net/itm/p/12443332.html

Parameter	Description	Value
Device Type	High Reliability CMOS Complex Programmable Logic Device (CPLD)	GAL20RA10B-20LP
Package	20-Lead Plastic Small Outline Package (PSOP)	20LP
Operating Voltage (V)	Supply Voltage Range	3.3V to 5.5V
I/O Pins	Number of Input/Output Pins	18
Macrocells	Number of Macrocells	10
Max Toggle Rate (MHz)	Maximum Toggle Rate per I/O Pin	100 MHz
Propagation Delay (ns)	Typical Propagation Delay Time	6 ns
Power Consumption (mW)	Typical Power Consumption at 5V, 100 MHz	150 mW
Temperature Range (°C)	Operating Temperature Range	-40°C to +85°C
Storage Temperature (°C)	Storage Temperature Range	-65°C to +150°C
ESD Protection (kV)	Electrostatic Discharge Protection	±2 kV HBM (Human Body Model)
Lead Finish	Lead Finish Option	SnPb (Tin-Lead) or Pb-Free
RoHS Compliance	Restriction of Hazardous Substances	Yes (Pb-Free option)

Instructions for Use

1. Power Supply:

   • Ensure the supply voltage is within the specified range (3.3V to 5.5V).
   • Use appropriate decoupling capacitors (0.1 μF and 10 μF) near the power pins to reduce noise.

2. Programming:

   • Use a compatible programmer to program the GAL20RA10B-20LP.
   • Follow the programming guidelines provided by the manufacturer to ensure correct configuration.

3. Input/Output Handling:

   • Do not exceed the maximum ratings for input/output voltages and currents.
   • Use pull-up or pull-down resistors as necessary to ensure stable logic levels.

4. Temperature Considerations:

   • Operate the device within the specified temperature range to avoid damage.
   • Ensure adequate cooling if operating at high temperatures or high frequencies.

5. Handling Precautions:

   • Handle the device with care to avoid mechanical damage.
   • Follow ESD precautions to prevent damage from static electricity.

6. Storage:

   • Store the device in a dry environment within the specified storage temperature range.
   • Use anti-static packaging when storing for extended periods.

7. Mounting:

   • Ensure proper alignment during soldering to avoid damage to the leads.
   • Use a reflow soldering process that complies with the recommended temperature profile.

8. Testing:

   • After assembly, perform functional tests to verify the correct operation of the device.
   • Use test vectors provided by the manufacturer for comprehensive testing.

For detailed specifications and additional information, refer to the datasheet provided by the manufacturer.

(For reference only)