Details

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BUY XC95108-15TQ100C https://www.utsource.net/itm/p/12443363.html

Parameter	Description	Value
Device Type	High-Density, Non-Volatile CPLD	XC95108
Package	100-Pin TQFP	TQ100
Speed Grade	Maximum Clock Frequency	150 MHz (15)
Operating Voltage	VCC Range	3.3V ± 0.3V
I/O Voltage	I/O Supply Voltage	3.3V ± 0.3V
I/O Count	Number of I/O Pins	72
Logic Cells	Number of Logic Cells	108
Macrocells	Number of Macrocells	108
Flip-Flops	Number of Flip-Flops	108
User Flash Memory	User Flash Memory Size	1280 bits
Package Pinout	Pin Configuration	Refer to Datasheet
Operating Temperature	Industrial Temperature Range	-40°C to +85°C
Storage Temperature	Storage Temperature Range	-65°C to +150°C
Power Consumption	Typical Power Consumption	100 mW (Typical)
Standby Current	Standby Current	1 μA (Typical)
Package Dimensions	Package Size	14 mm x 14 mm x 1.4 mm

Instructions for Use

1. Power Supply:

   • Ensure that the VCC supply is within the specified range of 3.3V ± 0.3V.
   • Connect the VCC pin to a stable 3.3V power source.
   • Connect the GND pins to a common ground.

2. Configuration:

   • Use a compatible programmer or configuration tool to load the desired logic design into the device.
   • Follow the programming guidelines provided in the datasheet for optimal results.

3. Signal Levels:

   • All I/O pins should be driven with signals within the specified voltage range (3.3V ± 0.3V).
   • Ensure that input signals are not left floating; use pull-up or pull-down resistors as necessary.

4. Temperature Considerations:

   • Operate the device within the industrial temperature range of -40°C to +85°C to ensure reliable performance.
   • Store the device in an environment with temperatures between -65°C and +150°C.

5. Power-Up Sequence:

   • Apply VCC before any I/O signals are active.
   • Allow sufficient time for the device to initialize before applying input signals.

6. Handling:

   • Handle the device with care to avoid damage from electrostatic discharge (ESD).
   • Use proper ESD protection equipment and procedures when handling the device.

7. Mounting:

   • Solder the device to the PCB according to the recommended soldering profile.
   • Ensure that the package is securely mounted to prevent mechanical stress.

For detailed information and specific application notes, refer to the XC95108 datasheet and related documentation.

(For reference only)