Details

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BUY STMicroelectronics L4962A https://www.utsource.net/itm/p/12444223.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Input Voltage	VIN		8		40	V
Output Voltage	VOUT		1.2		35	V
Output Current	IOUT			1.5		A
Dropout Voltage	VDROPOUT	IOUT = 1.5A		2.5		V
Quiescent Current	IQ	VIN = 12V, VOUT = 5V		60		mA
Shutdown Current	ISD	VIN = 12V, SHDN = 0V		0.1		μA
Thermal Shutdown	TSD			170		°C
Operating Junction Temp	TJOP		-40		150	°C
Storage Temperature	TSTG		-65		150	°C

Instructions for Use

1. Input Voltage (VIN):

   • Ensure the input voltage is within the range of 8V to 40V.
   • Do not exceed the maximum input voltage to avoid damaging the device.

2. Output Voltage (VOUT):

   • The output voltage can be adjusted from 1.2V to 35V.
   • Use external resistors to set the desired output voltage according to the datasheet formula.

3. Output Current (IOUT):

   • The maximum continuous output current is 1.5A.
   • Ensure the load does not exceed this limit to prevent overheating and potential damage.

4. Dropout Voltage (VDROPOUT):

   • At full load (1.5A), the dropout voltage is typically 2.5V.
   • Ensure the input voltage is at least 2.5V higher than the output voltage to maintain regulation.

5. Quiescent Current (IQ):

   • The quiescent current is typically 60mA when the input voltage is 12V and the output voltage is 5V.
   • This current is drawn even when there is no load on the output.

6. Shutdown Current (ISD):

   • When the shutdown pin (SHDN) is pulled low (0V), the device enters a low-power mode with a shutdown current of 0.1μA.
   • Use this feature to conserve power in battery-operated applications.

7. Thermal Shutdown (TSD):

   • The device will automatically shut down if the junction temperature exceeds 170°C to prevent thermal damage.
   • Ensure proper heat dissipation and cooling to keep the device within safe operating temperatures.

8. Operating Junction Temperature (TJOP):

   • The operating junction temperature range is from -40°C to 150°C.
   • Ensure the ambient temperature and heat dissipation are managed to keep the device within this range.

9. Storage Temperature (TSTG):

   • The device can be stored at temperatures ranging from -65°C to 150°C.
   • Avoid exposing the device to extreme temperatures outside this range during storage.

10. PCB Layout:

    • Follow recommended PCB layout guidelines to ensure optimal performance and reliability.
    • Use appropriate decoupling capacitors and ensure good ground connections to minimize noise and improve stability.

11. External Components:

    • Refer to the datasheet for specific values and types of external components required for the desired application.
    • Proper selection of external components is crucial for achieving the desired performance and efficiency.

(For reference only)