Details

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BUY TLP181 https://www.utsource.net/itm/p/12444358.html

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Forward Voltage	VF	-	1.2	1.6	V	IF = 20 mA, TA = 25掳C
Peak Forward Current	IF(P)	-	-	30	mA	tP = 10 ms, TA = 25掳C
Continuous Forward Current	IF	-	-	20	mA	TA = 25掳C
Reverse Voltage	VRRM	-	-	5	V	TA = 25掳C
Output Collector-Emitter Saturation Voltage	VCE(SAT)	-	0.4	0.7	V	IF = 20 mA, IO = 5 mA, TA = 25掳C
Output Collector Current	IC	-	-	5	mA	TA = 25掳C
Output Turn-On Time	ton	-	1	3	渭s	IF = 20 mA, RL = 100 惟, VCC = 5 V, TA = 25掳C
Output Turn-Off Time	toff	-	1	3	渭s	IF = 20 mA, RL = 100 惟, VCC = 5 V, TA = 25掳C
Isolation Voltage	VIORM	-	-	500	V	1 minute, 50/60 Hz
Operating Temperature Range	TA	-40	-	110	掳C	-

Instructions for Use:

1. Forward Current (I_F):

   • Ensure that the forward current does not exceed 20 mA continuously to avoid damaging the device.
   • For short durations (t_P = 10 ms), the peak forward current can be up to 30 mA.

2. Reverse Voltage (V_RRM):

   • The reverse voltage should not exceed 5 V to prevent breakdown.

3. Output Collector-Emitter Saturation Voltage (V_CE(SAT)):

   • When the output is on, the collector-emitter voltage should be between 0.4 V and 0.7 V under typical operating conditions.

4. Output Collector Current (I_C):

   • The maximum continuous collector current should not exceed 5 mA.

5. Turn-On and Turn-Off Times:

   • The typical turn-on time is 1 渭s and the turn-off time is also 1 渭s. These times can vary between 1 渭s and 3 渭s depending on the conditions.

6. Isolation Voltage (V_IORM):

   • The device provides isolation up to 500 V for 1 minute at 50/60 Hz.

7. Operating Temperature Range (T_A):

   • The device can operate in temperatures ranging from -40掳C to 110掳C.

8. Handling Precautions:

   • Handle the device with care to avoid static damage.
   • Ensure proper heat dissipation if the device is used in high-temperature environments or with high current loads.

9. Mounting:

   • Mount the device in a way that minimizes mechanical stress and ensures good thermal contact with the PCB or heatsink.

10. Storage:

    • Store the device in a dry, cool place away from direct sunlight and sources of heat.

(For reference only)