Details

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BUY DS1511Y+ https://www.utsource.net/itm/p/12444404.html

Parameter	Description	Min	Typ	Max	Unit
Operating Voltage	Supply voltage range	2.7	-	5.25	V
Standby Current	Quiescent current during idle state	-	0.3	-	μA
Active Current	Quiescent current during active state	-	1.5	-	mA
Output Current	Maximum output current per channel	-	-	50	mA
Operating Temperature	Range of ambient temperature for operation	-40	-	85	°C
Storage Temperature	Range of ambient temperature for storage	-65	-	150	°C
Input Voltage Range	Range of input voltages that can be switched	0	-	5.5	V
Propagation Delay	Time delay from input to output	-	20	-	ns
Channel-to-Channel Crosstalk	Isolation between channels	-	-	-60	dB
ESD Protection	Human body model (HBM)	-	-	2000	V

Instructions for Using DS1511Y+

1. Power Supply:

   • Connect the supply voltage (VCC) to a stable power source within the range of 2.7V to 5.25V.
   • Ensure the ground (GND) is properly connected.

2. Input Signals:

   • Apply the input signals to the appropriate input pins (IN1, IN2).
   • The input voltage should be within the range of 0V to 5.5V.

3. Output Configuration:

   • Connect the load to the output pins (OUT1, OUT2).
   • Ensure the load does not exceed the maximum output current of 50mA per channel.

4. Control Signals:

   • Use the control pins (EN1, EN2) to enable or disable the respective channels.
   • Set the control pin high (VCC) to enable the channel and low (GND) to disable it.

5. Temperature Considerations:

   • Operate the device within the temperature range of -40°C to 85°C for optimal performance.
   • Store the device within the temperature range of -65°C to 150°C.

6. ESD Precautions:

   • Handle the device with care to avoid electrostatic discharge (ESD).
   • Use proper ESD protection equipment when handling the device.

7. Crosstalk Management:

   • Ensure adequate spacing between channels to minimize crosstalk.
   • Use shielding if necessary to further reduce interference.

8. Propagation Delay:

   • Account for the propagation delay of 20ns in your timing calculations.

9. Mounting:

   • Mount the device on a PCB using standard surface mount technology (SMT) techniques.
   • Ensure proper soldering and alignment to avoid mechanical stress.

10. Testing:

    • After installation, test the device under various operating conditions to ensure it meets the required specifications.

(For reference only)