BTS824R

BTS824R


Specifications
SKU
12445045
Details

BUY BTS824R https://www.utsource.net/itm/p/12445045.html

Parameter Symbol Min Typ Max Unit Conditions/Notes
Continuous Current ICONT - 50 - A At TCASE = 25°C, VIN = 13.5V, RL = 2Ω
Peak Current IPEAK - 70 - A At TCASE = 25°C, VIN = 13.5V, tON < 5ms
Supply Voltage VIN 4.5 - 40 V -
Output Voltage VOUT - - 0.2 V At IOUT = 50A, TCASE = 25°C
Thermal Shutdown TSD - 160 - °C -
Operating Temperature TOP -40 - 150 °C -
Storage Temperature TSTG -40 - 150 °C -
Junction-to-Case Thermal Resistance RθJC - 1.0 - K/W -
Junction-to-Ambient Thermal Resistance RθJA - 35 - K/W -

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (VIN) is within the specified range of 4.5V to 40V.
    • Use appropriate decoupling capacitors close to the power input pins to minimize noise and ensure stable operation.
  2. Current Limiting:

    • The device is designed to handle a continuous current of up to 50A at a case temperature of 25°C.
    • For peak currents, do not exceed 70A for durations shorter than 5ms to avoid thermal damage.
  3. Thermal Management:

    • Monitor the junction temperature to ensure it does not exceed 160°C, which triggers thermal shutdown.
    • Use a heatsink or other cooling methods to manage heat dissipation effectively, especially under high load conditions.
  4. Operating and Storage Temperatures:

    • The device can operate in temperatures ranging from -40°C to 150°C.
    • Store the device in an environment with temperatures between -40°C and 150°C to prevent damage.
  5. Thermal Resistance:

    • The junction-to-case thermal resistance (RθJC) is 1.0 K/W, and the junction-to-ambient thermal resistance (RθJA) is 35 K/W.
    • These values are crucial for designing the thermal management system to keep the junction temperature within safe limits.
  6. Protection Features:

    • The device includes thermal shutdown protection to prevent damage due to excessive temperature.
    • Ensure proper PCB layout and thermal design to take advantage of these features.
  7. Mounting and Handling:

    • Follow standard handling procedures to avoid static discharge and mechanical stress.
    • Ensure proper mounting to the PCB and heatsink to maintain electrical and thermal performance.

By adhering to these parameters and instructions, you can ensure reliable and efficient operation of the BTS824R.

(For reference only)

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