Details

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BUY CA3260E https://www.utsource.net/itm/p/12445072.html

Parameter	Description	Min	Typ	Max	Unit
Supply Voltage (Vcc)	Operating supply voltage	10	-	40	V
Output Current (Iout)	Maximum output current per channel	-	100	-	mA
Input Voltage Range (Vin)	Range of input voltages for logic inputs	0	-	Vcc	V
Power Dissipation	Maximum power dissipation	-	-	1.5	W
Operating Temperature (Toper)	Temperature range for operation	-40	-	85	掳C
Storage Temperature (Tstg)	Temperature range for storage	-55	-	150	掳C
Quiescent Current (Iq)	Current consumed by the device when no load is applied	-	50	-	渭A

Instructions for Use

1. Supply Voltage:

   • Ensure the supply voltage (Vcc) is within the range of 10V to 40V.
   • Connect the positive terminal of the power supply to Vcc and the negative terminal to GND.

2. Output Current:

   • The maximum output current per channel is 100mA. Do not exceed this limit to avoid damage to the device.
   • Use appropriate external components (e.g., resistors) to limit current if necessary.

3. Input Voltage Range:

   • Logic inputs should be within the range of 0V to Vcc. Inputs outside this range can cause improper operation or damage.

4. Power Dissipation:

   • The maximum power dissipation is 1.5W. Ensure adequate heat sinking or cooling if operating near this limit.

5. Operating Temperature:

   • The device is designed to operate within the temperature range of -40掳C to 85掳C. Avoid exposing the device to temperatures outside this range during operation.

6. Storage Temperature:

   • Store the device in an environment with a temperature range of -55掳C to 150掳C to ensure long-term reliability.

7. Quiescent Current:

   • The quiescent current is typically 50渭A. This is the current consumed by the device when no load is applied.

8. Handling Precautions:

   • Handle the device with care to avoid static discharge, which can damage sensitive components.
   • Use proper ESD (Electrostatic Discharge) protection practices when handling the device.

9. Mounting:

   • Mount the device on a PCB using standard soldering techniques. Ensure good thermal contact with the PCB for efficient heat dissipation.

10. Testing:

    • Before final assembly, test the device under typical operating conditions to ensure it meets the specified parameters and performance criteria.

(For reference only)