Details
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Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
---|---|---|---|---|---|---|
Supply Voltage | VCC | Operating | 4.5 | 5.5 | V | |
Output Current per Pin | IO | Continuous | 200 | mA | ||
Peak Output Current | IOP | Pulse | 300 | mA | ||
Propagation Delay Time | tpd | VCC = 5V | 16 | ns | ||
Power Dissipation | PD | Continuous | 650 | mW | ||
Operating Temperature | Toper | Storage | -40 | 85 | °C | |
Storage Temperature | Tstg | -65 | 150 | °C |
Instructions for TPIC6B273DW:
Power Supply Connection:
- Connect the VCC pin to a stable power supply within the range of 4.5V to 5.5V.
- Ensure proper decoupling capacitors (typically 0.1μF) are placed close to the VCC and GND pins to minimize noise.
Input Signal Handling:
- The device operates with standard CMOS or TTL input levels.
- Ensure that input signals do not exceed VCC + 0.5V and do not go below GND - 0.5V to avoid damage.
Output Load Connection:
- Each output can drive up to 200mA continuously and 300mA peak current.
- For higher current applications, consider using external buffers or drivers.
Thermal Considerations:
- Keep the junction temperature within safe limits by ensuring adequate heat sinking if operating near maximum power dissipation.
- Monitor the device temperature especially in high ambient temperature environments.
Handling Precautions:
- This device is sensitive to electrostatic discharge (ESD). Use appropriate ESD protection measures during handling and installation.
- Avoid exposing the device to temperatures outside the specified storage range (-65°C to 150°C).
Layout Recommendations:
- Place the device as close as possible to other components it interfaces with to reduce trace lengths and parasitic inductance.
- Ensure good grounding practices to maintain signal integrity and reduce noise.
For detailed specifications and advanced usage, refer to the manufacturer’s datasheet.
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