Details

---

BUY SI4825A10 https://www.utsource.net/itm/p/12447299.html

Parameter	Symbol	Min	Typ	Max	Unit
Supply Voltage	VDD	1.6	-	5.5	V
Quiescent Current	IQ	-	1.2	-	渭A
Output Current	IO	-	100	-	mA
Continuous Output Power	PO	-	300	-	mW
Operating Temperature	TOPR	-40	-	85	掳C
Storage Temperature	TSTG	-55	-	150	掳C
Junction Temperature	TJ	-40	-	150	掳C
Thermal Resistance	R胃JA	-	120	-	掳C/W
ESD Rating (HBM)	-	-	2000	-	V

Instructions for Use

1. Supply Voltage:

   • Ensure the supply voltage (VDD) is within the range of 1.6V to 5.5V.
   • Exceeding these limits can damage the device.

2. Quiescent Current:

   • The typical quiescent current (IQ) is 1.2 渭A. This is the current consumed by the device when no load is applied.

3. Output Current:

   • The device can provide up to 100 mA of output current (IO). Ensure the load does not exceed this limit to avoid overheating or damage.

4. Continuous Output Power:

   • The continuous output power (PO) is 300 mW. Ensure the power dissipation is managed to prevent overheating, especially in high-power applications.

5. Operating Temperature:

   • The operating temperature (TOPR) range is from -40掳C to 85掳C. Ensure the device operates within this range to maintain reliability and performance.

6. Storage Temperature:

   • The storage temperature (TSTG) range is from -55掳C to 150掳C. Store the device in a dry and temperature-controlled environment to prevent damage.

7. Junction Temperature:

   • The junction temperature (TJ) should not exceed 150掳C. Proper heat sinking and thermal management are crucial, especially in high-power applications.

8. Thermal Resistance:

   • The thermal resistance (R胃JA) is 120掳C/W. Use appropriate heatsinks or cooling solutions to manage the temperature rise due to power dissipation.

9. ESD Rating:

   • The device has an ESD rating of 2000V (Human Body Model). Handle the device with care to avoid static discharge, which can damage the internal components.

10. Mounting and Handling:

    • Follow standard surface mount technology (SMT) guidelines for mounting the device on a PCB.
    • Use proper handling techniques to avoid mechanical stress and damage.

11. Testing and Validation:

    • Perform thorough testing and validation of the device in your specific application to ensure it meets all performance and reliability requirements.

By following these instructions, you can ensure the optimal performance and longevity of the SI4825A10 device.

(For reference only)