Details

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BUY 74LVC1G00GW,125 https://www.utsource.net/itm/p/12494020.html

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Supply Voltage	VCC	1.65	-	5.5	V	-
Input Low Voltage	VIL	-	-	0.8	V	VCC = 3.3V
Input High Voltage	VIH	2.0	-	-	V	VCC = 3.3V
Output Low Voltage	VOL	-	0.1	0.2	V	IOL = 4 mA, VCC = 3.3V
Output High Voltage	VOH	2.4	-	-	V	IOH = -4 mA, VCC = 3.3V
Propagation Delay Time	tpd	-	4.5	9.0	ns	VCC = 3.3V, TA = 25°C
Power Consumption	Ptot	-	-	1.0	mW	VCC = 3.3V, f = 1 MHz, TA = 25°C
Operating Temperature	TOP	-40	-	125	°C	-
Storage Temperature	TSTG	-65	-	150	°C	-

Instructions for Use:

1. Supply Voltage (V_CC):

   • Ensure the supply voltage is within the range of 1.65V to 5.5V to avoid damage to the device.

2. Input Voltage Levels:

   • For reliable operation, ensure that input voltages are within the specified ranges for V_IL and V_IH. For V_CC = 3.3V, V_IL should not exceed 0.8V and V_IH should be at least 2.0V.

3. Output Voltage Levels:

   • The output low voltage (V_OL) should not exceed 0.2V when sinking 4mA, and the output high voltage (V_OH) should be at least 2.4V when sourcing -4mA, both at V_CC = 3.3V.

4. Propagation Delay:

   • The propagation delay time (t_pd) is typically 4.5ns with a maximum of 9.0ns at V_CC = 3.3V and T_A = 25°C. This value can vary with temperature and supply voltage.

5. Power Consumption:

   • The total power consumption (P_tot) should not exceed 1.0mW under typical operating conditions (V_CC = 3.3V, f = 1 MHz, T_A = 25°C).

6. Temperature Ranges:

   • The device is designed to operate within a temperature range of -40°C to 125°C and can be stored between -65°C and 150°C.

7. Handling Precautions:

   • Handle the device with care to avoid static discharge, which can damage the internal circuits. Use appropriate ESD protection measures during handling and installation.

8. Mounting and Soldering:

   • Follow standard surface mount technology (SMT) guidelines for mounting and soldering. Ensure the soldering temperature and time are within the recommended limits to prevent thermal damage.

9. Testing:

   • Before finalizing the design, perform thorough testing to ensure the device meets all performance specifications under actual operating conditions.

(For reference only)