SK70DT16

SK70DT16

Category: ModulesIGBT

Specifications
SKU
12496657
Details

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Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage Vcc 4.5 5 5.5 V
Output Current Iout Continuous - 100 200 mA
Peak Output Current Ioutp Pulse - 300 500 mA
Operating Temperature Topr -40 - 85 °C
Storage Temperature Tstg -65 - 150 °C
Output Voltage Drop Vd Iout = 100mA - 0.4 0.7 V
Rise Time Tr RL = 100Ω - 5 10 μs
Fall Time Tf RL = 100Ω - 5 10 μs

Instructions for Use:

  1. Supply Voltage:

    • Ensure the supply voltage (Vcc) is within the range of 4.5V to 5.5V to avoid damage to the component.
  2. Output Current:

    • The continuous output current (Iout) should not exceed 200mA to prevent overheating and potential failure.
    • For pulse applications, the peak output current (Ioutp) can go up to 500mA, but ensure the duty cycle is low to avoid sustained high temperatures.
  3. Operating Temperature:

    • The device is designed to operate within a temperature range of -40°C to 85°C. Avoid operating outside this range to maintain reliability.
  4. Storage Temperature:

    • When storing the component, ensure the temperature is between -65°C and 150°C to prevent degradation.
  5. Output Voltage Drop:

    • At an output current of 100mA, the typical voltage drop (Vd) is 0.4V, with a maximum of 0.7V. This should be considered when designing the circuit to ensure adequate voltage levels.
  6. Rise and Fall Time:

    • The rise time (Tr) and fall time (Tf) are both typically 5μs with a maximum of 10μs when the load resistance (RL) is 100Ω. These values help in designing the timing aspects of the circuit.
  7. Handling and Installation:

    • Handle the component with care to avoid static discharge, which can damage the internal circuits.
    • Follow proper soldering techniques to ensure good electrical connections without overheating the component.
  8. Testing:

    • Before integrating the component into a final design, test it under the specified conditions to ensure it meets the required performance parameters.
  9. Documentation:

    • Refer to the datasheet for more detailed information and specific application notes.
(For reference only)

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