TLP521-2GB

TLP521-2GB


Specifications
SKU
12508746
Details

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Parameter Symbol Min Typ Max Unit Condition
Forward Voltage VF - 1.2 1.6 V IF = 10 mA
Reverse Voltage VRRM - - 5 V
Continuous Forward Current IF - - 30 mA
Peak Forward Current IFP - - 100 mA t = 10 ms
Reverse Current IR - 100 - nA VR = 5 V
Collector-Emitter Breakdown Voltage V(BR)CEO - - 30 V IC = 5 mA, TR = 25°C
Collector-Emitter Saturation Voltage VCE(sat) - 0.45 0.8 V IC = 5 mA, IF = 5 mA, TR = 25°C
Collector Current IC - - 30 mA VCE = 5 V, IF = 5 mA, TR = 25°C
Turn-On Time ton - 3 5 μs IF = 5 mA, IC = 5 mA, RL = 300 Ω, VCC = 5 V
Turn-Off Time toff - 2 4 μs IF = 5 mA, IC = 5 mA, RL = 300 Ω, VCC = 5 V
Storage Temperature TSTG -40 - 110 °C
Operating Temperature TA -40 - 105 °C

Instructions for Use:

  1. Mounting and Handling:

    • Handle the TLP521-2GB with care to avoid damage to the leads or the body.
    • Ensure that the device is mounted on a suitable PCB with proper soldering techniques.
  2. Electrical Connections:

    • Connect the anode (A) and cathode (K) leads to the input circuit.
    • Connect the collector (C) and emitter (E) leads to the output circuit.
    • Ensure that the reverse voltage across the diode does not exceed the maximum rating (VRRM).
  3. Power Supply:

    • The power supply voltage (VCC) should be within the specified range to ensure reliable operation.
    • Ensure that the current through the LED (IF) is within the continuous forward current limit (IF).
  4. Thermal Management:

    • The operating temperature should be kept within the specified range to prevent thermal damage.
    • Consider using a heat sink if the device will be operating at high temperatures or high currents.
  5. Signal Timing:

    • The turn-on and turn-off times should be considered when designing the circuit to ensure proper timing and switching performance.
  6. Storage:

    • Store the device in a dry, cool place to prevent moisture damage.
    • Avoid exposing the device to extreme temperatures or humidity.
  7. Testing:

    • Before final assembly, test the device to ensure it meets the specified electrical parameters.
    • Use appropriate test equipment and methods to avoid damaging the device during testing.
(For reference only)

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