Details

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BUY ADUM7701BRWZ https://www.utsource.net/itm/p/12510813.html

Parameter	Symbol	Min	Typical	Max	Unit	Notes
Input Voltage	VIN	3.0	-	5.5	V	Supply voltage for the digital side
Output Voltage	VOUT	3.0	-	5.5	V	Supply voltage for the analog side
Isolation Rating		2.5	-	5.0	kV	Working voltage
Maximum Data Rate	fDATA	-	100	150	Mbps	Data rate through the isolator
Propagation Delay	tPD	-	35	65	ns	Time delay from input to output
Channel-to-Channel Skew	tSKEW	-	4	8	ns	Maximum skew between channels
Power Consumption	Idd	-	9	12	mA	Current consumption at 5V
Operating Temperature	Toper	-40	-	125	°C	Operating temperature range
Storage Temperature	Tstg	-65	-	150	°C	Storage temperature range
Humidity	RH	0	-	100	%	Relative humidity, non-condensing
ESD Rating	HBM	-	-	8	kV	Human Body Model
Package Type		-	-	-	SOIC-8	Surface Mount Package

Instructions:

1. Power Supply:

   • Ensure that the input voltage (VIN) and output voltage (VOUT) are within the specified range (3.0V to 5.5V).
   • Use appropriate decoupling capacitors (0.1μF and 10μF) close to the power supply pins to minimize noise and ensure stable operation.

2. Data Transmission:

   • The ADUM7701BRWZ supports data rates up to 150 Mbps. Ensure that the signal integrity is maintained by using proper termination resistors if necessary.
   • The propagation delay is typically 35 ns, but can vary between 35 ns and 65 ns. Account for this delay in your system timing.

3. Isolation:

   • The device provides isolation up to 5.0 kV. Ensure that the isolation barrier is not exceeded to avoid damage or failure.
   • Follow all safety guidelines and regulations when handling high-voltage circuits.

4. Temperature and Environmental Conditions:

   • The operating temperature range is -40°C to 125°C. Ensure that the device is used within this range to avoid thermal stress.
   • Store the device in a dry environment with relative humidity between 0% and 100% (non-condensing).

5. ESD Protection:

   • The device has an ESD rating of 8 kV (HBM). Handle the device with care to avoid static discharge, which can damage the internal components.

6. Mounting and Handling:

   • Use standard surface mount technology (SMT) procedures for mounting the SOIC-8 package.
   • Avoid mechanical stress on the pins and the body of the device during soldering and handling.

7. Testing and Verification:

   • After assembly, verify the functionality of the device by testing the data transmission and isolation performance.
   • Use an oscilloscope to measure the propagation delay and ensure it falls within the specified range.

For detailed application notes and further information, refer to the official ADUM7701BRWZ datasheet provided by Analog Devices.

(For reference only)