Details

BUY 74HC245PW https://www.utsource.net/itm/p/12511173.html

Parameter Symbol Min Typ Max Unit
Supply Voltage VCC 2.0 - 6.0 V
Input Low Voltage VIL - - 1.5 V
Input High Voltage VIH 3.5 - - V
Output Low Voltage VOL - 0.1 0.4 V
Output High Voltage VOH 2.4 - VCC-0.5 V
Input Current (Low) IIL - -1 - mA
Input Current (High) IIH - 20 - 渭A
Output Current (Low) IOL -15 - - mA
Output Current (High) IOH - - 15 mA
Propagation Delay Time tpd - 8 20 ns
Power Dissipation PD - - 100 mW
Operating Temperature Range TA -40 - 85 掳C
Storage Temperature Range TSTG -65 - 150 掳C

Instructions for Using 74HC245PW

  1. Power Supply:

    • Connect VCC to the positive supply voltage (2.0V to 6.0V).
    • Connect GND to the ground.
  2. Direction Control:

    • The direction of data transfer is controlled by the DIR pin.
    • When DIR = 0, data is transferred from A to B.
    • When DIR = 1, data is transferred from B to A.
  3. Output Enable:

    • The output enable pin (OE) controls whether the outputs are active or high-impedance.
    • When OE = 0, the outputs are active.
    • When OE = 1, the outputs are in high-impedance state.
  4. Data Inputs and Outputs:

    • Connect the data inputs (A0-A7) and data outputs (B0-B7) to the appropriate signals in your circuit.
    • Ensure that the input signals are within the valid range (VIL and VIH).
  5. Propagation Delay:

    • The propagation delay time (tpd) is the time it takes for a change in the input signal to be reflected at the output. It typically ranges from 8 to 20 nanoseconds.
  6. Temperature Considerations:

    • The device operates over a temperature range of -40掳C to 85掳C.
    • Store the device in a temperature range of -65掳C to 150掳C.
  7. Power Dissipation:

    • Ensure that the power dissipation does not exceed 100 mW to avoid overheating and potential damage to the device.
  8. Handling Precautions:

    • Handle the device with care to avoid static damage.
    • Use proper anti-static measures when handling and storing the device.
  9. Testing:

    • Before integrating the device into a larger system, test its functionality using a simple circuit to ensure it meets the required specifications.
(For reference only)

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