Details

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BUY PCF1252-1T/F4,118 https://www.utsource.net/itm/p/12511198.html

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Supply Voltage	VCC	1.7	-	5.5	V	-
Output Current	IO	-	100	150	mA	Continuous
Peak Output Current	IOPK	-	-	200	mA	Pulse Width ≤ 10 ms, Duty Cycle ≤ 1%
Output Voltage	VO	-	3.3	5.0	V	-
Quiescent Current	IQ	-	0.6	1.0	mA	No Load
Dropout Voltage	VDROP	-	0.3	0.6	V	IO = 100 mA
Operating Temperature	TOP	-40	-	85	°C	-
Storage Temperature	TSTG	-40	-	125	°C	-
Thermal Shutdown	TSD	-	160	-	°C	-
Enable Input Voltage	VEN	0.8	-	1.2	V	Low Level
Enable Input Voltage	VEN	1.3	-	-	V	High Level

Instructions:

1. Supply Voltage (V_CC):

   • Ensure the supply voltage is within the range of 1.7 V to 5.5 V.

2. Output Current (I_O):

   • The device can provide a continuous output current of up to 150 mA. For higher currents, refer to the peak output current specifications.

3. Peak Output Current (I_OPK):

   • The device can handle peak currents up to 200 mA for short durations (≤ 10 ms) with a duty cycle of ≤ 1%.

4. Output Voltage (V_O):

   • The output voltage is typically 3.3 V but can be adjusted between 3.3 V and 5.0 V depending on the application.

5. Quiescent Current (I_Q):

   • The quiescent current is typically 0.6 mA and should not exceed 1.0 mA when no load is connected.

6. Dropout Voltage (V_DROP):

   • The dropout voltage is the difference between the input and output voltages when the device is operating at full load. It is typically 0.3 V and should not exceed 0.6 V at 100 mA output current.

7. Operating Temperature (T_OP):

   • The device is designed to operate within a temperature range of -40 °C to 85 °C.

8. Storage Temperature (T_STG):

   • Store the device in an environment where the temperature does not exceed -40 °C to 125 °C.

9. Thermal Shutdown (T_SD):

   • The device will automatically shut down if the temperature exceeds 160 °C to prevent damage.

10. Enable Input Voltage (V_EN):

    • The enable input is active high. The device will turn on when V_EN is above 1.3 V and turn off when it is below 0.8 V.

11. Handling and Storage:

    • Handle the device with care to avoid static discharge and physical damage.
    • Store the device in a dry, cool place away from direct sunlight and sources of heat.

12. Mounting and Soldering:

    • Follow standard surface mount technology (SMT) procedures for mounting and soldering.
    • Use a controlled temperature profile to avoid thermal shock during soldering.

(For reference only)