Details

---

BUY IR21814STRPBF https://www.utsource.net/itm/p/12520649.html

Parameter	Description	Min	Typ	Max	Unit
VCC	Supply Voltage	10	-	20	V
VB	Bootstrapping Supply Voltage	10	-	20	V
VGS(th)	Gate Threshold Voltage	2.0	3.5	5.0	V
IOUT	Output Current (High Side)	-	-	2.0	A
IOUT	Output Current (Low Side)	-	-	2.0	A
td(on)	Turn-On Delay Time	50	-	100	ns
td(off)	Turn-Off Delay Time	50	-	100	ns
tr	Rise Time	25	-	50	ns
tf	Fall Time	25	-	50	ns
VSS	Logic Supply Voltage	4.5	-	20	V
VIL	Input Low Voltage	0.8	-	1.5	V
VIH	Input High Voltage	2.0	-	VCC	V
IIL	Input Leakage Current	-1	-	1	μA
IOL	Output Leakage Current	-1	-	1	μA
Tj	Junction Temperature	-40	-	150	°C
TA	Ambient Operating Temperature	-40	-	125	°C

Instructions for Using IR21814STRPBF:

1. Supply Voltage (V_CC and V_B):

   • Ensure that the supply voltages are within the specified range (10V to 20V).
   • V_B is used for bootstrapping the high-side driver.

2. Gate Threshold Voltage (V_GS(th)):

   • The device will start conducting when the gate-to-source voltage exceeds the threshold voltage (2.0V to 5.0V).

3. Output Current:

   • The maximum output current for both high-side and low-side drivers is 2.0A.

4. Timing Parameters:

   • Ensure that the turn-on delay time (t_d(on)), turn-off delay time (t_d(off)), rise time (t_r), and fall time (t_f) are within the specified limits to avoid improper switching.

5. Logic Supply Voltage (V_SS):

   • The logic supply voltage should be between 4.5V and 20V.

6. Input Voltages (V_IL and V_IH):

   • The input low voltage (V_IL) should be between 0.8V and 1.5V.
   • The input high voltage (V_IH) should be at least 2.0V and can go up to the supply voltage (V_CC).

7. Leakage Currents:

   • The input leakage current (I_IL) and output leakage current (I_OL) should be kept within ±1μA.

8. Temperature Ranges:

   • The junction temperature (T_j) should not exceed 150°C.
   • The ambient operating temperature (T_A) should be between -40°C and 125°C.

9. Mounting and Handling:

   • Use appropriate handling techniques to avoid damage from electrostatic discharge (ESD).
   • Ensure proper heat dissipation to maintain the junction temperature within the specified range.

10. Testing and Verification:

    • Before finalizing the design, test the circuit under various operating conditions to ensure reliable performance.

(For reference only)