Details

---

BUY IRFR4615PBF https://www.utsource.net/itm/p/12529611.html

Parameter	Symbol	Min	Typ	Max	Unit	Notes
Drain-Source Voltage	VDS	-	-	30	V	-
Gate-Source Voltage	VGS	-10	-	4	V	-
Continuous Drain Current	ID	-	-	7.8	A	@ TC = 25°C, VGS = 4V
Pulse Drain Current	ID(p)	-	-	23	A	@ TC = 25°C, VGS = 4V, tp = 300μs, Duty Cycle = 1%
Power Dissipation	PD	-	-	11.7	W	@ TA = 25°C
Junction Temperature	TJ	-	-	150	°C	-
Storage Temperature	TSTG	-55	-	150	°C	-
Thermal Resistance	RθJC	-	1.3	-	°C/W	-
Input Capacitance	Ciss	-	190	-	pF	@ VDS = 10V, f = 1MHz
Output Capacitance	Coss	-	48	-	pF	@ VDS = 10V, f = 1MHz
Reverse Transfer Capacitance	Crss	-	25	-	pF	@ VDS = 10V, f = 1MHz
Gate Charge	QG	-	25	-	nC	@ VDS = 10V, VGS = 4V
Total Gate Charge	QGT	-	30	-	nC	@ VDS = 10V, VGS = 4V

Instructions for Use:

1. Mounting and Handling:

   • Ensure proper heat sinking to maintain junction temperature within safe limits.
   • Handle with care to avoid static damage. Use ESD protection when handling the device.

2. Electrical Connections:

   • Connect the drain (D), source (S), and gate (G) terminals correctly.
   • Ensure that the gate-source voltage (V_GS) does not exceed the maximum rating of 4V to prevent damage.

3. Thermal Management:

   • Monitor the junction temperature (T_J) to ensure it does not exceed 150°C.
   • Use appropriate thermal interface materials (TIMs) to improve heat dissipation.

4. Pulse Operation:

   • For pulse operation, ensure that the pulse duration (t_p) and duty cycle do not exceed the specified limits to avoid overheating.

5. Storage:

   • Store the device in a dry, cool environment within the storage temperature range of -55°C to 150°C.

6. Testing:

   • During testing, apply voltages and currents within the specified limits to avoid damaging the device.
   • Use a suitable test setup to measure parameters like input capacitance (C_iss), output capacitance (C_oss), and reverse transfer capacitance (C_rss).

7. Soldering:

   • Follow recommended soldering profiles to avoid thermal shock and damage to the device.
   • Use a controlled temperature soldering iron and avoid excessive heat exposure.

8. Application Notes:

   • Refer to application notes and datasheets for detailed information on specific applications and circuit design considerations.

For more detailed information, refer to the official datasheet provided by the manufacturer.

(For reference only)