IRFW644B

IRFW644B


Specifications
SKU
12532067
Details

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Parameter Symbol Min Typ Max Unit Conditions
Continuous Drain Current ID - 20 - A TC = 25°C
Pulse Drain Current Ipp - 130 - A t = 10 ms, duty cycle = 1%
Continuous Gate-Source Voltage VGS -20 - 20 V -
Drain-Source Breakdown Voltage VDSS 55 - - V -
Gate-Source Leakage Current IGSS - ±100 - nA VGS = ±20V, TC = 25°C
Drain-Source On-State Resistance RDS(on) 45 - 70 mΩ VGS = 10V, ID = 20A, TC = 25°C
Gate Charge QG - 80 - nC VGS = 10V, VDS = 25V
Total Switching Energy ETS - 4.2 - μJ VDS = 45V, ID = 20A, f = 100kHz
Junction Temperature Tj -55 - 175 °C -
Storage Temperature Range Tstg -55 - 150 °C -

Instructions for Use:

  1. Mounting and Handling:

    • Handle the device with care to avoid mechanical stress.
    • Ensure proper heat sinking if operating at high currents or in high ambient temperatures.
  2. Electrical Connections:

    • Connect the drain (D), source (S), and gate (G) terminals correctly.
    • Use short, low-inductance leads to minimize parasitic inductance.
  3. Gate Drive:

    • Apply a gate-source voltage (VGS) of at least 10V to ensure full turn-on and minimum RDS(on).
    • Use a gate resistor to control the rise and fall times of the gate signal, reducing switching losses and electromagnetic interference (EMI).
  4. Thermal Management:

    • Monitor the junction temperature (Tj) to ensure it does not exceed 175°C.
    • Use a heatsink or thermal pad to dissipate heat effectively, especially under continuous high current conditions.
  5. Pulse Operation:

    • For pulse operation, ensure that the pulse width and duty cycle do not exceed the specified limits to avoid overheating.
  6. Storage:

    • Store the device in a dry, cool place within the storage temperature range (-55°C to 150°C).
  7. ESD Protection:

    • Handle the device with ESD protection measures to prevent damage from static electricity.
  8. Testing:

    • Test the device under controlled conditions to verify its performance and reliability before integrating it into a circuit.
  9. Compliance:

    • Ensure that the device is used in compliance with all relevant safety and regulatory standards.
(For reference only)

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