Details

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BUY AGB75LC04-QU-E https://www.utsource.net/itm/p/12532436.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Supply Voltage	VCC	1.65	-	5.5	V	Operating supply voltage range
Output Current	IO	-	25	50	mA	Maximum continuous output current
Input Voltage Range	VI	0	-	VCC	V	Input voltage range for logic levels
Propagation Delay Time	tpd	-	8	15	ns	Propagation delay time (typical)
Power Consumption	Ptot	-	10	20	mW	Total power consumption at VCC = 5V, TA = 25°C
Operating Temperature	TA	-40	-	85	°C	Ambient operating temperature range
Storage Temperature	TSTG	-55	-	150	°C	Storage temperature range
Junction Temperature	TJ	-40	-	150	°C	Maximum junction temperature

Instructions:

1. Supply Voltage (V_CC):

   • Ensure the supply voltage is within the specified range (1.65V to 5.5V) to avoid damage to the device.

2. Output Current (I_O):

   • Do not exceed the maximum continuous output current of 50mA to prevent overheating and potential failure.

3. Input Voltage Range (V_I):

   • The input voltage should be within the range of 0V to V_CC to ensure proper logic level recognition.

4. Propagation Delay Time (t_pd):

   • The typical propagation delay time is 8ns, with a maximum of 15ns. This is crucial for timing considerations in your circuit design.

5. Power Consumption (P_tot):

   • The total power consumption should not exceed 20mW at V_CC = 5V and T_A = 25°C to maintain optimal performance and reliability.

6. Operating Temperature (T_A):

   • The ambient operating temperature should be between -40°C and 85°C to ensure reliable operation.

7. Storage Temperature (T_STG):

   • Store the device in an environment where the temperature ranges from -55°C to 150°C to prevent degradation.

8. Junction Temperature (T_J):

   • The junction temperature should not exceed 150°C to avoid thermal damage to the device.

9. Handling Precautions:

   • Handle the device with care to avoid static discharge, which can damage the internal components.
   • Use appropriate ESD protection measures during handling and installation.

10. Mounting and Soldering:

    • Follow recommended soldering profiles to ensure proper bonding without causing thermal stress to the device.
    • Avoid excessive heat and mechanical stress during the mounting process.

(For reference only)