STMICROELECTRONICS STP26NM60N

STMICROELECTRONICS STP26NM60N


Specifications
Details

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Parameter Symbol Min Typ Max Unit Conditions
Drain-Source Voltage VDSS - - 600 V
Gate-Source Voltage VGS -15 - 15 V
Continuous Drain Current ID - - 26 A Tc = 25°C
Power Dissipation PD - - 270 W Tc = 25°C
Junction Temperature TJ -55 - 150 °C
Storage Temperature Tstg -55 - 150 °C
Total Gate Charge Qg - 89 - nC VGS = 15V, IDS = 26A
Input Capacitance Ciss - 3400 - pF VDS = 300V, VGS = 0V
Output Capacitance Coss - 950 - pF VDS = 300V, VGS = 0V
Reverse Transfer Capacitance Crss - 310 - pF VDS = 300V, VGS = 0V

Instructions for Use:

  1. Mounting and Handling:

    • Ensure the device is mounted on a suitable heatsink to manage the power dissipation effectively.
    • Handle with care to avoid damage to the leads or body of the component.
  2. Electrical Connections:

    • Connect the gate (G), drain (D), and source (S) terminals as per your circuit design.
    • Ensure proper insulation between the gate and other parts of the circuit to prevent leakage currents.
  3. Operating Conditions:

    • Operate within the specified voltage and current limits to ensure reliable performance.
    • Keep the junction temperature within the operational range to avoid thermal runaway.
  4. Testing and Verification:

    • Before final assembly, test the device under controlled conditions to verify its performance parameters.
    • Use appropriate protective equipment when testing high-voltage circuits.
  5. Storage:

    • Store in a dry, cool place away from direct sunlight.
    • Avoid exposure to corrosive environments to maintain terminal integrity.

For detailed application notes and more specific guidelines, refer to the datasheet provided by STMicroelectronics.

(For reference only)

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