Details

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BUY TC54VN2902ECB713 https://www.utsource.net/itm/p/12532811.html

Parameter	Symbol	Min	Typical	Max	Unit	Conditions
Supply Voltage	Vcc	2.7		5.5	V
Operating Temperature	Toper	-40		85	°C
Storage Temperature	Tstg	-65		150	°C
Output Current (LDO)	Iout		250	300	mA	Vout = 3.3V, Ta = 25°C
Quiescent Current	Iq		5	10	μA	Vout = 3.3V, No Load, Ta = 25°C
Dropout Voltage	Vdo		200	300	mV	Iout = 100mA, Vout = 3.3V, Ta = 25°C
Line Regulation			0.1		%/V	Vout = 3.3V, Iout = 100mA, Vcc = 2.7V to 5.5V, Ta = 25°C
Load Regulation			0.1		%/mA	Vout = 3.3V, Vcc = 3.3V, Iout = 0 to 100mA, Ta = 25°C
Transient Response Time			10		μs	Vout = 3.3V, Iout step from 0 to 100mA, Ta = 25°C
Ripple Rejection			60		dB	Vout = 3.3V, f = 1kHz, Vcc = 3.3V, Iout = 100mA, Ta = 25°C
Enable Input High Level	Vih	2.0		5.5	V
Enable Input Low Level	Vil	0		0.8	V
Enable Input Current	Iin		1	5	μA	Vcc = 5.5V, Venable = 0V, Ta = 25°C
Shutdown Current	Ishd		0.1	1	μA	Vcc = 5.5V, Venable = 0V, Ta = 25°C

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (Vcc) is within the range of 2.7V to 5.5V.
   • Use appropriate decoupling capacitors (typically 10μF and 0.1μF) close to the Vcc and GND pins to stabilize the power supply.

2. Output Capacitor:

   • Use a ceramic capacitor with a value of 10μF or higher on the output to ensure stability and minimize ripple.

3. Enable Pin:

   • The enable pin (EN) can be used to turn the LDO on or off.
   • Apply a high level (Vih > 2.0V) to turn the LDO on.
   • Apply a low level (Vil < 0.8V) to turn the LDO off.
   • When the LDO is off, the shutdown current (Ishd) will be very low (0.1μA to 1μA).

4. Thermal Management:

   • Ensure adequate heat dissipation if operating at high output currents or in high ambient temperatures.
   • Consider using a heatsink or thermal pad if necessary.

5. Transient Response:

   • The LDO has a typical transient response time of 10μs. Ensure that the load changes do not exceed this capability to avoid output voltage droop.

6. Storage and Handling:

   • Store the device in a dry environment to prevent moisture damage.
   • Handle with care to avoid static discharge, which can damage the device.

7. Mounting:

   • Follow standard surface mount technology (SMT) procedures for mounting the device.
   • Ensure proper soldering to all pins, including the thermal pad if present.

8. Testing:

   • Before final assembly, test the device under expected operating conditions to ensure it meets the required specifications.

For more detailed information, refer to the datasheet provided by the manufacturer.

(For reference only)