MAX501BCNG

MAX501BCNG

Category: IC Chips

Specifications
Details

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Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage VDD Operating 4.5 5.5 V
Output Current (Sink) ISNK Per Channel 30 mA
Output Current (Source) ISRC Per Channel 30 mA
Power Dissipation PD All Channels On 180 mW
Operating Temperature TJ Junction -40 85 °C
Storage Temperature TSTG -65 150 °C
Input Leakage Current IL VIN = VDD, TA = 25°C -1 1 μA
Output Leakage Current IOL VOUT = 0V, TA = 25°C -10 10 μA

Instructions for MAX501BCNG

  1. Power Supply:

    • Ensure the supply voltage (VDD) is within the operating range of 4.5V to 5.5V.
  2. Output Current Handling:

    • The device can source or sink up to 30mA per channel. Ensure not to exceed this limit to avoid damage.
  3. Thermal Considerations:

    • Keep the junction temperature (TJ) between -40°C and 85°C during operation.
    • For storage, ensure temperatures remain between -65°C and 150°C.
  4. Leakage Current:

    • Be aware of input leakage current which should not exceed ±1μA at room temperature.
    • Output leakage current should be monitored to ensure it remains within ±10μA.
  5. Application Notes:

    • When all channels are on, monitor power dissipation to stay below 180mW to prevent overheating.
    • Always refer to the datasheet for detailed application circuits and specific guidelines.
(For reference only)

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