Details

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BUY IS61WV204816BLL-10TLI https://www.utsource.net/itm/p/12532831.html

Parameter	Description	Value
Device Type	High-Speed CMOS SRAM	2M x 16
Package Type	TQFP (Thin Quad Flat Package)	44-Pin
Supply Voltage (Vcc)	Operating Voltage Range	3.3V ± 0.3V
Operating Temperature	Industrial Temperature Range	-40°C to +85°C
Access Time (tAC)	Access Time	10 ns
Cycle Time (tCYC)	Minimum Cycle Time	10 ns
Output Enable (OE#)	Output Enable Pin	Active Low
Write Enable (WE#)	Write Enable Pin	Active Low
Chip Select (CS#)	Chip Select Pin	Active Low
Data Retention	Data Retention Time at Vcc = 3.3V	20 years at 25°C
Power Consumption	Active Power Consumption (Typical)	250 mW (at 100 MHz)
Standby Current	Standby Current (Typical)	20 μA
Input Clamping Voltage	Input Clamping Voltage (VIH, VIL)	-0.5V to Vcc + 0.5V
Output Drive Strength	Output Drive Strength (IOL, IOH)	24 mA (min)
Propagation Delay	Propagation Delay Time (tPD)	10 ns (max)
Slew Rate	Output Slew Rate	Controlled
Pin Configuration	Pin Configuration Diagram	Refer to Datasheet

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage is within the specified range of 3.3V ± 0.3V.
   • Use decoupling capacitors (e.g., 0.1 μF and 10 μF) close to the power pins to minimize noise.

2. Signal Timing:

   • The access time (tAC) and cycle time (tCYC) must be adhered to for reliable operation.
   • Ensure that the output enable (OE#), write enable (WE#), and chip select (CS#) signals are properly controlled and meet the timing requirements.

3. Data Retention:

   • Data retention is guaranteed for up to 20 years at 25°C. Store the device in a cool, dry environment to maximize data retention.

4. Power Consumption:

   • The active power consumption is typical at 250 mW when operating at 100 MHz. Ensure adequate cooling or heat dissipation if operating at high frequencies.

5. Standby Mode:

   • To enter standby mode, set the chip select (CS#) pin to a high state. The standby current is typically 20 μA.

6. Input/Output Handling:

   • Ensure input voltages do not exceed the clamping voltage range of -0.5V to Vcc + 0.5V.
   • The output drive strength is 24 mA minimum, which should be sufficient for most applications.

7. Slew Rate Control:

   • The output slew rate is controlled to minimize EMI (Electromagnetic Interference).

8. Pin Configuration:

   • Refer to the pin configuration diagram in the datasheet for correct pin assignments and connections.

9. Storage and Handling:

   • Store the device in a static-protective bag to prevent damage from ESD (Electrostatic Discharge).
   • Handle the device with care, avoiding excessive mechanical stress on the pins and package.

For detailed specifications and additional information, refer to the full datasheet provided by the manufacturer.

(For reference only)