CM800E6C-66H

CM800E6C-66H

Category: ModulesIGBT

Specifications
SKU
12533329
Details

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Parameter Symbol Min Typ Max Unit Conditions
Rated Voltage VRRM - 650 - V
Rated RMS Current IF(AV) - 12 - A Tj = 75°C, 100% Duty Cycle
Non-Repetitive Peak Surge Current IFSM - 1200 - A Tj = 25°C, 10 μs pulse width, 1% duty cycle
Forward Voltage Drop VF - 1.4 - V IF = 12 A, Tj = 25°C
Reverse Recovery Time trr - 35 - ns IRM = 12 A, dI/dt = 100 A/μs, Tj = 25°C
Junction to Case Thermal Resistance RθJC - 0.5 - °C/W
Operating Junction Temperature Range Tj -55 - 150 °C
Storage Temperature Range Tstg -55 - 150 °C

Instructions for Use:

  1. Mounting:

    • Ensure proper heat sinking to maintain junction temperature within specified limits.
    • Use recommended mounting torque for the package to ensure good thermal contact.
  2. Surge Current Handling:

    • The device can handle non-repetitive peak surge currents up to 1200 A for short durations (10 μs pulse width, 1% duty cycle). Ensure adequate cooling during such events.
  3. Forward Current:

    • Do not exceed the rated RMS current of 12 A continuously at 75°C junction temperature. For higher temperatures, derate the current accordingly.
  4. Reverse Voltage:

    • The device is rated for a maximum reverse voltage of 650 V. Ensure that the applied voltage does not exceed this limit to avoid breakdown.
  5. Thermal Management:

    • Monitor the junction temperature to ensure it remains within the operating range (-55°C to 150°C). Use thermal sensors if necessary.
  6. Storage:

    • Store the device in a dry environment within the storage temperature range (-55°C to 150°C) to prevent damage.
  7. Electrical Connections:

    • Ensure all connections are secure and free from corrosion. Use appropriate wire gauges to handle the rated current.
  8. Handling:

    • Handle the device with care to avoid mechanical stress, which can lead to internal damage. Follow ESD (Electrostatic Discharge) precautions to prevent damage from static electricity.
  9. Testing:

    • Before installing the device in a circuit, perform initial testing to verify its parameters and functionality. Use a controlled test environment to avoid damaging the device.
  10. Compliance:

    • Ensure that the device complies with relevant safety and regulatory standards for your application.
(For reference only)

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