MX29GL256FHXFI-90Q

MX29GL256FHXFI-90Q

Category: IC Chips

Specifications
Details

BUY MX29GL256FHXFI-90Q https://www.utsource.net/itm/p/12534367.html

Parameter Description Value
Device Type Flash Memory MX29GL256FHXFI-90Q
Memory Density Total Bits 256 Mbit
Organization Data Width x8/x16
Package Type - TSOP II
Number of Pins - 48-pin
Operating Voltage (Vcc) Supply Voltage 3.3V ± 0.3V
Operating Temperature Range Temp. Range -40°C to +85°C
Access Time tAA 70ns (max)
Programming Voltage Vpp Not Required (Single Supply)
Erase/Program Cycle Endurance 100,000 cycles (min)
Data Retention - 20 years (min)
Write Protection Feature Hardware and Software Protection

Instructions:

  1. Power Supply Requirements: Ensure the supply voltage is within the specified range of 3.0V to 3.6V.
  2. Initialization: Upon power-up, initialize the device by following the initialization sequence detailed in the datasheet.
  3. Addressing: Use the appropriate addressing mode based on whether the device is configured for x8 or x16 data width.
  4. Programming: Follow the programming algorithm provided in the datasheet for writing data. Ensure that write protection features are properly configured to prevent accidental data overwrite.
  5. Erase Operations: Perform block or sector erase operations as required. Ensure no active writes are occurring before initiating an erase cycle.
  6. Temperature Considerations: Operate within the specified temperature range to ensure reliable performance.
  7. Handling Precautions: Handle with care to avoid damage from electrostatic discharge (ESD). Use proper ESD precautions when handling the device.
  8. Mounting: Ensure proper mounting on the PCB to maintain electrical and mechanical integrity.

For detailed timing diagrams, command sequences, and other specific information, refer to the official datasheet of the MX29GL256FHXFI-90Q.

(For reference only)

View more about MX29GL256FHXFI-90Q on main site