Details

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BUY 74HC7541N https://www.utsource.net/itm/p/12534395.html

Parameter	Description	Min	Typ	Max	Unit
VCC	Supply Voltage	2.0	-	6.0	V
ICC	Supply Current (per output)	-	10	30	渭A
VIH	Input High Level Voltage	3.5	-	VCC	V
VIL	Input Low Level Voltage	0	-	1.5	V
VOH	Output High Level Voltage	2.4	-	VCC - 0.5	V
VOL	Output Low Level Voltage	0	-	0.4	V
IOH	Output High Level Current	-	0.4	-	mA
IOL	Output Low Level Current	-	8	-	mA
tpd	Propagation Delay Time	0	15	40	ns
tr	Rise Time	0	10	30	ns
tf	Fall Time	0	10	30	ns
tskew	Skew Between Outputs	-	5	10	ns

Instructions for Use

1. Supply Voltage (V_CC):

   • Ensure the supply voltage is within the range of 2.0V to 6.0V.
   • Connect V_CC to the positive power supply and GND to the ground.

2. Input Levels (V_IH, V_IL):

   • Inputs should be driven with high levels between 3.5V and V_CC.
   • Inputs should be driven with low levels between 0V and 1.5V.

3. Output Levels (V_OH, V_OL):

   • The output high level will be between 2.4V and V_CC - 0.5V.
   • The output low level will be between 0V and 0.4V.

4. Current Ratings (I_CC, I_OH, I_OL):

   • The supply current per output should not exceed 30渭A.
   • The output high level current should not exceed 0.4mA.
   • The output low level current should not exceed 8mA.

5. Timing Parameters (t_pd, t_r, t_f, t_skew):

   • The propagation delay time (t_pd) should be between 0ns and 40ns.
   • The rise time (t_r) and fall time (t_f) should be between 0ns and 30ns.
   • The skew between outputs (t_skew) should be between 0ns and 10ns.

6. Handling Precautions:

   • Handle the IC with care to avoid static damage.
   • Ensure all connections are secure and free from short circuits.
   • Avoid exceeding the maximum ratings as it can lead to device failure.

7. Storage and Operating Temperature:

   • Store the IC in a dry environment to prevent moisture damage.
   • The operating temperature range is typically -40掳C to +85掳C.

8. Pin Configuration:

   • Refer to the datasheet for the specific pin configuration and functions.
   • Ensure correct pin connections to avoid damage to the IC.

9. Testing and Verification:

   • Test the IC under typical operating conditions to verify its functionality.
   • Use appropriate test equipment to measure input and output signals accurately.

(For reference only)