FGH60N60SFD FGH60N60 60N60 TO-247

FGH60N60SFD FGH60N60 60N60 TO-247

Category: Transistors

Specifications
SKU
12534760
Details

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Below is the parameter table and instructions for the FGH60N60SFD (FGH60N60) 60N60 TO-247 N-Channel MOSFET.

Parameter Table

Parameter Symbol Min Typ Max Unit Test Conditions
Drain-Source Voltage VDS - - 600 V -
Gate-Source Voltage VGS -15 - 20 V -
Continuous Drain Current ID - 60 - A TC = 25掳C
Continuous Drain Current ID - 38 - A TC = 100掳C
Pulse Drain Current ID(p) - 120 - A tp = 10 ms, TC = 25掳C
Total Power Dissipation PTOT - - 190 W TC = 25掳C
Junction Temperature TJ - - 175 掳C -
Storage Temperature Range TSTG -55 - 150 掳C -
Gate Charge QG - 110 - nC VGS = 10V, ID = 10A
Input Capacitance Ciss - 3800 - pF VDS = 300V, f = 1 MHz
Output Capacitance Coss - 240 - pF VDS = 300V, f = 1 MHz
Reverse Transfer Capacitance Crss - 100 - pF VDS = 300V, f = 1 MHz
On-State Resistance RDS(on) - 0.18 - VGS = 10V, ID = 20A, TJ = 25掳C
Threshold Voltage VGS(th) 2.0 3.0 4.0 V ID = 250 渭A, TA = 25掳C
Maximum Gate-Source Voltage VGS(max) -15 - 20 V -

Instructions

  1. Handling and Storage:

    • Handle the device with care to avoid damage to the leads and the body.
    • Store the device in a dry, cool place away from direct sunlight and corrosive substances.
    • Ensure that the storage temperature range is between -55掳C and 150掳C.
  2. Mounting:

    • Use a heat sink to manage the thermal dissipation effectively, especially when operating at high currents or power levels.
    • Ensure proper mechanical alignment and secure mounting to prevent mechanical stress on the device.
    • Apply thermal compound between the device and the heat sink to enhance thermal conductivity.
  3. Electrical Connections:

    • Connect the drain (D), source (S), and gate (G) terminals correctly to the circuit.
    • Use short and thick wires to minimize parasitic inductance and resistance.
    • Ensure that the gate drive voltage is within the specified range (-15V to +20V).
  4. Operation:

    • Operate the device within the specified temperature range to avoid thermal runaway and ensure reliable performance.
    • Monitor the junction temperature (TJ) to ensure it does not exceed 175掳C.
    • Use appropriate gate drive circuits to switch the MOSFET efficiently and avoid excessive switching losses.
  5. Testing:

    • Test the device under controlled conditions to verify its performance parameters.
    • Use a suitable test setup to measure parameters such as on-state resistance, threshold voltage, and gate charge.

By following these instructions, you can ensure the optimal performance and longevity of the FGH60N60SFD MOSFET.

(For reference only)

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