TPA3132D2RHBR

TPA3132D2RHBR

Category: IC Chips

Specifications
Details

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Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage VDD Operating 2.7 - 5.5 V
Quiescent Current IQ VDD = 5V, BTL mode - 1.8 - mA
Output Power POUT RL = 4Ω, THD = 10% - 0.65 - W
Efficiency η POUT = 0.5W - 85 - %
PSRR f = 217Hz - 75 - dB
SNR A-weighted - 95 - dB
THD+N POUT = 0.5W - 0.05 - %
Shutdown Current ISD VDD = 5V - 1 - μA

Instructions for TPA3132D2RHBR:

  1. Power Supply Connection:

    • Connect the supply voltage (VDD) within the range of 2.7V to 5.5V.
  2. Grounding:

    • Ensure a solid ground connection to avoid noise and instability.
  3. Speaker Configuration:

    • For Bridge-Tied Load (BTL) mode, connect speakers with an impedance of at least 4Ω to maximize output power without exceeding thermal limits.
  4. Thermal Management:

    • The device should be mounted on a suitable heatsink if operating near maximum power levels to ensure proper heat dissipation.
  5. Input Signal:

    • Apply input signals that do not exceed the maximum allowable level to prevent distortion or damage.
  6. Shutdown Mode:

    • To put the device into shutdown mode, pull the SHDN pin low. This reduces the current consumption to about 1μA.
  7. Efficiency Considerations:

    • Operate within recommended conditions to achieve typical efficiency values up to 85%.
  8. Noise and Distortion:

    • Keep signal paths short and use bypass capacitors close to the power pins to minimize noise and improve THD+N performance.
  9. Installation:

    • Handle with care to avoid static damage. Follow ESD precautions as outlined in the datasheet.
  10. Testing:

    • When testing, use appropriate test equipment and methods to ensure accurate measurement of parameters like SNR and THD+N.
(For reference only)

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