MIC4427BN

MIC4427BN

Category: IC Chips

Specifications
SKU
12535395
Details

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Parameter Symbol Conditions Min Typical Max Unit
Input Voltage VIN Continuous 2.7 - 5.5 V
Output Voltage VOUT Adjustable, Set by External Resistor Divider - - - V
Output Current IOUT Continuous - 1.0 1.5 A
Quiescent Current IQ VIN = 3V, No Load - 2.2 - μA
Dropout Voltage VDROPOUT IOUT = 1.0A, VIN = 3.3V - 0.4 - V
Shutdown Current ISD VIN = 3V, SHDN = 0V - 0.1 - μA
Thermal Shutdown TSD - - 160 - °C
Operating Junction Temperature TJ - -20 - 125 °C
Storage Temperature TSTG - -40 - 150 °C

Instructions for Use:

  1. Input Voltage (VIN):

    • Ensure the input voltage is within the range of 2.7V to 5.5V.
    • The device is designed to operate efficiently within this range.
  2. Output Voltage (VOUT):

    • The output voltage is adjustable and can be set using an external resistor divider.
    • Connect the feedback pin (FB) to the output through a resistor (R1) and ground through another resistor (R2).
    • Use the formula: VOUT = 1.25 * (1 + R1/R2) to calculate the desired output voltage.
  3. Output Current (IOUT):

    • The device can provide a continuous output current of up to 1.5A, with a typical value of 1.0A.
    • Ensure that the load does not exceed these limits to avoid damage.
  4. Quiescent Current (IQ):

    • The quiescent current is typically 2.2μA at 3V input with no load.
    • This low quiescent current helps in reducing power consumption in battery-operated applications.
  5. Dropout Voltage (VDROPOUT):

    • The dropout voltage is typically 0.4V when the output current is 1.0A and the input voltage is 3.3V.
    • This low dropout voltage allows the regulator to maintain regulation even when the input voltage is close to the output voltage.
  6. Shutdown Current (ISD):

    • When the shutdown pin (SHDN) is pulled low (0V), the device enters a low-power shutdown mode.
    • The shutdown current is typically 0.1μA at 3V input.
  7. Thermal Shutdown (TSD):

    • The device has built-in thermal protection that activates at approximately 160°C.
    • This feature helps prevent damage due to excessive heat.
  8. Operating Junction Temperature (TJ):

    • The operating junction temperature range is from -20°C to 125°C.
    • Ensure that the device operates within this temperature range to avoid performance degradation or damage.
  9. Storage Temperature (TSTG):

    • The storage temperature range is from -40°C to 150°C.
    • Store the device in a dry environment within this temperature range to ensure long-term reliability.

Layout Considerations:

  • Place the input and output capacitors as close as possible to the device to minimize noise and improve stability.
  • Use a low ESR capacitor for the output to reduce ripple and improve transient response.
  • Ensure proper heat sinking if the device is expected to dissipate significant power.
(For reference only)

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