Details

---

BUY XC3042A-7PQ100C https://www.utsource.net/itm/p/12535398.html

Parameter	Description	Value
Device Type	High-Speed CMOS Programmable Logic Device (PLD)	XC3042A
Package Type	Plastic Quad Flat Pack (PQFP)	PQ100
Operating Temperature	Industrial Temperature Range	-40°C to +85°C
Supply Voltage (Vcc)	Operating Supply Voltage	3.3V ± 0.3V
I/O Voltage	Input/Output Voltage	3.3V
Number of I/Os	Number of Input/Output Pins	68
Number of Macrocells	Number of Programmable Macrocells	42
Programmable Terms	Number of Programmable AND Gates per Macrocell	16
Maximum Frequency	Maximum Clock Frequency	100 MHz
Configuration Memory	Non-Volatile Configuration Memory	EEPROM
Programming Method	In-System Programming (ISP)	JTAG, Parallel
Power Consumption	Typical Power Consumption	100 mW (at 100 MHz)
Standby Current	Standby Current	10 μA
Package Pin Count	Number of Pins in Package	100
Lead Finish	Lead Finish	Tin

Instructions for XC3042A-7PQ100C

1. Power Supply Connection:

   • Connect Vcc to all Vcc pins (3.3V).
   • Connect GND to all GND pins.

2. Programming:

   • Use JTAG or parallel programming methods to configure the device.
   • Ensure the programming voltage (Vpp) is set to 12.75V for parallel programming.
   • For JTAG programming, connect the TDI, TDO, TCK, and TMS pins to the programmer.

3. Configuration:

   • The device can be configured using a configuration file (bitstream) generated by Xilinx ISE or Vivado.
   • Ensure the configuration file is compatible with the XC3042A device.

4. Input/Output Handling:

   • Set the input/output pins as required using the configuration file.
   • Ensure that all unused I/O pins are tied to Vcc or GND to prevent floating states.

5. Clock Management:

   • Connect the clock signal to the appropriate clock input pin (CLK).
   • Use the internal or external clock sources as specified in the design.

6. Thermal Considerations:

   • Ensure adequate heat dissipation if the device is operating at high frequencies or under heavy load.
   • Place the device on a PCB with sufficient copper area for heat spreading.

7. Storage and Handling:

   • Store the device in a dry, static-free environment.
   • Handle the device with ESD protection to avoid damage.

8. Testing:

   • After programming, test the device to ensure it functions as expected.
   • Use boundary scan testing (JTAG) to verify the integrity of the device and connections.

For detailed specifications and additional information, refer to the Xilinx datasheet for the XC3042A-7PQ100C.

(For reference only)