NTB25P06G

NTB25P06G


Specifications
Details

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Parameter Symbol Min Typ Max Unit Description
Breakdown Voltage BVdss - - 60 V Drain-source breakdown voltage
Continuous Drain Current Id - 2.5 - A Continuous drain current at Tc = 25°C
Pulse Drain Current Ipm - 13 - A Pulse drain current (t = 10 μs)
Gate Threshold Voltage Vgs(th) 1.0 2.0 4.0 V Gate threshold voltage
On-State Resistance Rds(on) 0.25 - - Ω On-state resistance at Vgs = 10V
Input Capacitance Ciss - 1100 - pF Input capacitance
Output Capacitance Coss - 250 - pF Output capacitance
Total Device Dissipation Ptot - - 2.0 W Total device dissipation
Junction Temperature Tj -25 - 175 °C Operating junction temperature range
Storage Temperature Tstg -55 - 150 °C Operating storage temperature range

Instructions for Use:

  1. Handling and Installation:

    • Handle the NTB25P06G with care to avoid damage to the leads or body.
    • Ensure proper heat sinking if operating near maximum power dissipation.
  2. Biasing and Operation:

    • Apply gate voltages within the specified limits to prevent gate oxide damage.
    • Operate within the continuous drain current ratings to avoid overheating.
  3. Mounting:

    • Mount on a suitable heatsink if necessary, especially for high-power applications.
    • Ensure good thermal contact between the device and heatsink.
  4. Storage:

    • Store in a dry, cool place away from direct sunlight.
    • Avoid exposure to corrosive environments.
  5. Testing:

    • Test the device under controlled conditions to ensure it meets application requirements.
    • Refer to datasheet for detailed testing procedures and specifications.
(For reference only)

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