Details
BUY NTB25P06G https://www.utsource.net/itm/p/12536035.html
| Parameter | Symbol | Min | Typ | Max | Unit | Description |
|---|---|---|---|---|---|---|
| Breakdown Voltage | BVdss | - | - | 60 | V | Drain-source breakdown voltage |
| Continuous Drain Current | Id | - | 2.5 | - | A | Continuous drain current at Tc = 25°C |
| Pulse Drain Current | Ipm | - | 13 | - | A | Pulse drain current (t = 10 μs) |
| Gate Threshold Voltage | Vgs(th) | 1.0 | 2.0 | 4.0 | V | Gate threshold voltage |
| On-State Resistance | Rds(on) | 0.25 | - | - | Ω | On-state resistance at Vgs = 10V |
| Input Capacitance | Ciss | - | 1100 | - | pF | Input capacitance |
| Output Capacitance | Coss | - | 250 | - | pF | Output capacitance |
| Total Device Dissipation | Ptot | - | - | 2.0 | W | Total device dissipation |
| Junction Temperature | Tj | -25 | - | 175 | °C | Operating junction temperature range |
| Storage Temperature | Tstg | -55 | - | 150 | °C | Operating storage temperature range |
Instructions for Use:
Handling and Installation:
- Handle the NTB25P06G with care to avoid damage to the leads or body.
- Ensure proper heat sinking if operating near maximum power dissipation.
Biasing and Operation:
- Apply gate voltages within the specified limits to prevent gate oxide damage.
- Operate within the continuous drain current ratings to avoid overheating.
Mounting:
- Mount on a suitable heatsink if necessary, especially for high-power applications.
- Ensure good thermal contact between the device and heatsink.
Storage:
- Store in a dry, cool place away from direct sunlight.
- Avoid exposure to corrosive environments.
Testing:
- Test the device under controlled conditions to ensure it meets application requirements.
- Refer to datasheet for detailed testing procedures and specifications.
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