Details

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BUY TDF8544J/N3,112 https://www.utsource.net/itm/p/12536053.html

Parameter	Symbol	Min	Typical	Max	Unit	Notes
Supply Voltage	Vcc	4.5	5.0	5.5	V
Standby Current	Icc	-	1.5	2.5	mA
Operating Temperature	Topr	-40	-	85	°C
Storage Temperature	Tstg	-65	-	150	°C
Output Current per Channel	Iout	0	20	30	mA
Maximum Power Dissipation	Pd	-	700	-	mW	@ TA = 25°C
Input Capacitance	Cin	-	10	-	pF
Output Capacitance	Cout	-	100	-	pF
Rise Time	tr	-	50	-	ns
Fall Time	tf	-	50	-	ns

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (Vcc) is within the specified range of 4.5V to 5.5V.
   • Use a stable power source to avoid fluctuations that could affect performance.

2. Current Handling:

   • The maximum output current per channel is 30mA. Do not exceed this limit to prevent damage to the device.
   • For applications requiring higher currents, consider using external drivers or transistors.

3. Temperature Considerations:

   • The operating temperature range is from -40°C to 85°C. Ensure the device is used within this range to maintain reliability.
   • Store the device in an environment with temperatures between -65°C and 150°C.

4. Power Dissipation:

   • The maximum power dissipation at room temperature (25°C) is 700mW. Use appropriate heat sinks or cooling methods if the device is expected to operate near this limit.

5. Capacitance:

   • The input capacitance is typically 10pF. Ensure any external circuits or components do not significantly increase this value.
   • The output capacitance is typically 100pF. This should be considered when designing load circuits.

6. Timing Parameters:

   • The rise and fall times are both typically 50ns. These values can affect the performance of high-speed circuits, so ensure they are compatible with your application.

7. Handling and Storage:

   • Handle the device with care to avoid static discharge, which can damage sensitive components.
   • Store the device in a dry, cool place to prevent moisture damage.

8. Soldering:

   • Use a soldering iron with a temperature no higher than 300°C to avoid damaging the device during assembly.
   • Follow standard soldering practices to ensure good electrical connections and mechanical stability.

9. Testing:

   • Before integrating the device into a larger system, test it individually to verify its functionality and performance.
   • Use a multimeter to check for short circuits and open circuits before applying power.

By following these guidelines, you can ensure the optimal performance and longevity of the TDF8544J/N3,112.

(For reference only)