TLP700

TLP700


Specifications
SKU
12536100
Details

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Parameter Symbol Min Typ Max Unit Conditions
Forward Voltage VF - 1.2 1.6 V IF = 20 mA
Reverse Voltage VR - - 5 V
Peak Forward Current IF(PK) - - 30 mA t < 1 ms, IF(AV) = 10 mA
Continuous Forward Current IF(AV) - 10 20 mA TA = 25°C
Output Collector-Emitter Voltage VCE(OFF) - - 0.5 V IF = 0, IO = 0
Output Collector Current IC - 5 10 mA IF = 5 mA, VCE = 5 V
Isolation Voltage VIORM - - 2500 Vrms 1 min, 50/60 Hz
Storage Temperature TSTG -40 - 110 °C
Operating Temperature TA -40 - 85 °C

Instructions for Use:

  1. Forward Voltage (VF):

    • Ensure that the forward voltage across the LED does not exceed 1.6V to prevent damage.
    • Typical operating voltage is around 1.2V at a forward current of 20 mA.
  2. Reverse Voltage (VR):

    • The maximum reverse voltage that can be applied is 5V. Exceeding this value can cause damage to the device.
  3. Peak Forward Current (IF(PK)):

    • The peak forward current should not exceed 30 mA for pulse durations less than 1 ms. The average forward current should not exceed 10 mA at room temperature (25°C).
  4. Continuous Forward Current (IF(AV)):

    • The continuous forward current should be kept below 20 mA to ensure reliable operation. At room temperature (25°C), a typical value is 10 mA.
  5. Output Collector-Emitter Voltage (VCE(OFF)):

    • When no current is flowing through the LED (IF = 0) and no output current is present (IO = 0), the collector-emitter voltage should not exceed 0.5V.
  6. Output Collector Current (IC):

    • The output collector current should be within the range of 5 to 10 mA when the forward current is 5 mA and the collector-emitter voltage is 5 V.
  7. Isolation Voltage (VIORM):

    • The device can withstand an isolation voltage of up to 2500 Vrms for 1 minute at 50/60 Hz. This ensures electrical isolation between the input and output sides.
  8. Storage Temperature (TSTG):

    • Store the device in a temperature range of -40°C to 110°C to avoid degradation or damage.
  9. Operating Temperature (TA):

    • The device is designed to operate in ambient temperatures ranging from -40°C to 85°C. Ensure that the operating environment does not exceed these limits.
  10. Handling and Mounting:

    • Handle the device with care to avoid mechanical stress.
    • Ensure proper soldering techniques to avoid thermal shock and ensure a reliable connection.
    • Follow the recommended PCB layout guidelines to minimize interference and improve performance.
(For reference only)

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