Details

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BUY SN74HCT541N https://www.utsource.net/itm/p/12536105.html

Parameter	Symbol	Min	Typical	Max	Unit	Conditions
Supply Voltage	VCC	2.0	-	6.0	V
Input Low Voltage	VIL	-	0.8	-	V	VCC = 5V
Input High Voltage	VIH	-	2.0	-	V	VCC = 5V
Output Low Voltage	VOL	-	0.4	0.5	V	IOL = 8 mA, VCC = 5V
Output High Voltage	VOH	2.4	-	-	V	IOH = -400 μA, VCC = 5V
Input Leakage Current	IIL	-1.0	-	1.0	μA	VCC = 5V
Output Leakage Current	IOL	-	10	-	μA	VCC = 5V, VO = 0V
Propagation Delay Time (High to Low)	tpd(HL)	-	12	-	ns	VCC = 5V, TA = 25°C
Propagation Delay Time (Low to High)	tpd(LH)	-	12	-	ns	VCC = 5V, TA = 25°C
Power Dissipation	PD	-	-	350	mW	Per Package
Operating Temperature Range	TA	-40	-	85	°C
Storage Temperature Range	TSTG	-65	-	150	°C

Instructions for Use:

1. Supply Voltage:

   • The SN74HCT541N operates with a supply voltage range of 2.0V to 6.0V. Ensure that the power supply is stable and within this range.

2. Input Voltage Levels:

   • For reliable operation, input low voltages should be below 0.8V, and input high voltages should be above 2.0V when V_CC is 5V.

3. Output Voltage Levels:

   • The output low voltage (V_OL) should not exceed 0.5V when sourcing 8mA, and the output high voltage (V_OH) should be at least 2.4V when sinking -400μA, with V_CC at 5V.

4. Leakage Current:

   • Input leakage current should be kept within ±1.0μA, and output leakage current should be within ±10μA to avoid unintended switching or excessive power consumption.

5. Propagation Delay:

   • The typical propagation delay times are 12ns for both high-to-low and low-to-high transitions at V_CC = 5V and T_A = 25°C.

6. Power Dissipation:

   • The maximum power dissipation per package is 350mW. Ensure adequate heat dissipation if operating near this limit.

7. Temperature Ranges:

   • The device can operate over a temperature range of -40°C to 85°C and can be stored between -65°C and 150°C.

8. Handling:

   • Handle the device with care to avoid damage from electrostatic discharge (ESD). Use appropriate ESD protection measures during handling and installation.

9. Mounting:

   • Ensure proper mounting and soldering techniques to prevent mechanical stress and ensure good electrical connections.

10. Testing:

    • Before integrating the SN74HCT541N into a circuit, test it individually to verify its functionality and performance parameters.

(For reference only)