Details

---

BUY EPC1PI8N https://www.utsource.net/itm/p/12536580.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Drain-Source Voltage	VDS	-	-	600	V	Maximum voltage between drain and source with the gate open.
Gate-Source Voltage	VGS	-20	-	20	V	Maximum voltage between gate and source.
Continuous Drain Current	ID	-	8.5	-	A	Continuous drain current at TJ = 25°C.
Pulse Drain Current	IDpeak	-	34	-	A	Peak pulse drain current (tp = 10 μs, IG = 10 A).
Power Dissipation	PTOT	-	-	100	W	Total power dissipation at TC = 25°C.
Junction Temperature	TJ	-	-	175	°C	Maximum junction temperature.
Storage Temperature	TSTG	-55	-	150	°C	Operating storage temperature range.

Instructions for Use:

1. Handling Precautions:

   • ESD Protection: The EPC1PI8N is sensitive to electrostatic discharge (ESD). Use appropriate ESD protection measures such as wrist straps, static-safe work surfaces, and ESD-safe packaging.
   • Polarity: Ensure correct polarity when connecting the device to avoid damage.

2. Mounting:

   • Thermal Management: Proper heat sinking is essential to manage the thermal resistance and ensure the device operates within its safe operating area (SOA).
   • Mechanical Stress: Avoid applying excessive mechanical stress to the leads or body of the device during soldering or handling.

3. Operating Conditions:

   • Voltage Ratings: Do not exceed the maximum ratings for V_DS, V_GS, and I_D. Exceeding these limits can cause permanent damage.
   • Temperature: Monitor the junction temperature (T_J) to ensure it does not exceed 175°C. Use thermal management techniques such as heatsinks or cooling fans if necessary.

4. Testing:

   • Initial Testing: Perform initial testing at low power levels to verify proper operation before moving to higher power applications.
   • Parameter Verification: Regularly check key parameters such as V_DS, I_D, and T_J to ensure the device is functioning correctly.

5. Storage:

   • Environmental Conditions: Store the device in a dry, cool environment within the specified storage temperature range (-55°C to 150°C).
   • Packaging: Keep the device in its original ESD-safe packaging until ready for use.

6. Soldering:

   • Soldering Temperature: Use a controlled soldering process with a maximum soldering temperature of 260°C for no more than 10 seconds per lead.
   • Cooling: Allow the device to cool naturally after soldering to avoid thermal shock.

By following these guidelines, you can ensure reliable and efficient operation of the EPC1PI8N.

(For reference only)