Details

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BUY IP101GRI https://www.utsource.net/itm/p/12540159.html

Parameter	Description	Value
Device Type	Ethernet Physical Layer Transceiver	-
Interface	10/100BASE-TX Ethernet	-
Operating Voltage (Vcc)	Supply Voltage	3.3V ± 5%
Operating Current	Typical Operating Current	200mA
Data Rate	Data Transmission Speed	10/100 Mbps
Operating Temperature	Industrial Temperature Range	-40°C to +85°C
Storage Temperature	Storage Temperature Range	-65°C to +150°C
Package	Package Type	24-pin SSOP (Small Outline Package)
ESD Protection	Electrostatic Discharge Protection	±2kV HBM (Human Body Model)
MTBF	Mean Time Between Failures	> 1,000,000 hours at 25°C
Compliance	Regulatory Compliance	CE, FCC, RoHS

Instructions for Use

1. Power Supply:

   • Connect the 3.3V supply voltage to the Vcc pin and ground to the GND pin.
   • Ensure the power supply is stable and within the specified range to avoid damage to the device.

2. Ethernet Connection:

   • Connect the RJ45 connector to the appropriate pins on the IP101GRI.
   • Use standard Cat5 or Cat5e cables for reliable data transmission.

3. MCU Interface:

   • Connect the MII (Media Independent Interface) or RMII (Reduced Media Independent Interface) pins to your microcontroller or processor.
   • Refer to the specific pinout diagram for correct connections.

4. Reset:

   • Apply a low signal to the RESET pin to reset the device.
   • Ensure the reset pulse is at least 100ns in duration.

5. Configuration:

   • Use the configuration registers to set up the device according to your application requirements.
   • Refer to the datasheet for detailed register maps and configuration settings.

6. Temperature Considerations:

   • Operate the device within the industrial temperature range (-40°C to +85°C) to ensure reliable performance.
   • Avoid exposing the device to extreme temperatures outside the storage range.

7. ESD Handling:

   • Handle the device with ESD precautions to prevent damage from static electricity.
   • Use grounded wrist straps and anti-static mats when handling the device.

8. Testing:

   • After assembly, perform functional tests to ensure the device is operating correctly.
   • Check for proper data transmission and reception over the Ethernet interface.

9. Mounting:

   • Solder the device to the PCB using standard surface mount technology (SMT) procedures.
   • Ensure proper soldering to all pins to avoid cold solder joints and ensure reliable electrical connections.

10. Documentation:

    • Refer to the datasheet and application notes for more detailed information and specific use cases.
    • Keep documentation readily available for troubleshooting and future reference.

(For reference only)