DSEI2X61-12B

DSEI2X61-12B


Specifications
SKU
12541458
Details

BUY DSEI2X61-12B https://www.utsource.net/itm/p/12541458.html

Parameter Symbol Min Typical Max Unit
Input Voltage VIN 4.5 - 14 V
Output Voltage VOUT - 12 - V
Output Current IOUT - 1.5 3 A
Efficiency η - 90 - %
Switching Frequency fSW - 650 - kHz
Quiescent Current IQ - 100 - μA
Load Regulation - - ±1 - %
Line Regulation - - ±1 - %
Ripple (Output) Vripple - 20 - mVp-p
Operating Temperature TOPR -40 - 85 °C
Storage Temperature TSTG -40 - 125 °C
Thermal Resistance (θJA) - - 35 - °C/W

Instructions for Using DSEI2X61-12B

  1. Input Voltage:

    • Ensure the input voltage is within the range of 4.5V to 14V.
    • Do not exceed the maximum input voltage to avoid damage to the device.
  2. Output Voltage:

    • The output voltage is fixed at 12V. No external adjustments are required.
  3. Output Current:

    • The device can provide up to 3A of output current, with a typical output of 1.5A.
    • Ensure the load does not exceed the maximum output current to prevent overheating or damage.
  4. Efficiency:

    • The efficiency of the device is typically 90%. This ensures minimal power loss during operation.
  5. Switching Frequency:

    • The switching frequency is set to 650kHz. This helps in reducing the size of external components like inductors and capacitors.
  6. Quiescent Current:

    • The quiescent current is typically 100μA. This low current draw ensures efficient operation even under light loads.
  7. Load and Line Regulation:

    • Both load and line regulation are ±1%. This ensures stable output voltage over varying input voltages and load conditions.
  8. Ripple (Output):

    • The output ripple is typically 20mV peak-to-peak. Use appropriate filtering if lower ripple is required.
  9. Operating Temperature:

    • The operating temperature range is from -40°C to 85°C. Ensure the device operates within this range to maintain reliability.
  10. Storage Temperature:

    • The storage temperature range is from -40°C to 125°C. Store the device in a dry, cool place to prevent degradation.
  11. Thermal Resistance (θJA):

    • The thermal resistance is typically 35°C/W. Ensure adequate heat dissipation, especially when operating at high output currents.
  12. Mounting and Layout:

    • Follow recommended PCB layout guidelines to ensure optimal performance and thermal management.
    • Place the device away from heat sources and ensure proper airflow around the component.
  13. Safety Precautions:

    • Handle the device with care to avoid static discharge, which can damage sensitive components.
    • Use appropriate protective equipment when handling the device.

By following these instructions, you can ensure the reliable and efficient operation of the DSEI2X61-12B.

(For reference only)

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