Details

---

BUY SPF5002 https://www.utsource.net/itm/p/12541490.html

Parameter	Description	Value
Input Voltage (VIN)	Operating input voltage range	4.75V to 5.25V
Output Voltage (VOUT)	Fixed output voltage	3.3V ±2%
Output Current (IOUT)	Maximum continuous output current	2A
Quiescent Current (IQ)	Current consumption in normal operation	1.5mA typical
Dropout Voltage (VDROP)	Voltage difference between VIN and VOUT at IOUT = 2A	0.4V typical
Thermal Shutdown (TSD)	Temperature at which the device shuts down to prevent damage	160°C typical
Short-Circuit Protection	Protection against short circuits on the output	Yes, automatic recovery
Package Type	Physical package of the device	SOT-223
Operating Temperature Range (TA)	Ambient temperature range for operation	-40°C to +85°C

Instructions:

1. Power Supply Connection:

   • Connect the input voltage (V_IN) to the input pin.
   • Ensure the input voltage is within the specified range (4.75V to 5.25V).

2. Output Connection:

   • Connect the load to the output pin (V_OUT).
   • The output voltage will be regulated to 3.3V ±2%.

3. Ground Connection:

   • Connect the ground (GND) pin to the common ground of the system.

4. Capacitors:

   • Place a 10μF tantalum or ceramic capacitor close to the input pin to filter out noise and stabilize the input voltage.
   • Place a 10μF tantalum or ceramic capacitor close to the output pin to ensure stable output regulation.

5. Thermal Considerations:

   • Ensure adequate heat dissipation if operating at high output currents.
   • Use a heatsink if necessary, especially when operating near the maximum output current.

6. Short-Circuit Protection:

   • The device has built-in short-circuit protection that will automatically recover once the fault condition is removed.

7. Storage and Handling:

   • Store in a dry environment to avoid moisture damage.
   • Handle with care to avoid static discharge, which can damage the device.

8. Mounting:

   • Solder the device according to the recommended soldering profile for the SOT-223 package.
   • Ensure all pins are properly aligned and soldered to the PCB.

9. Testing:

   • After assembly, test the device under normal operating conditions to ensure it meets the specified performance parameters.

(For reference only)