Details

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BUY TK160F10N1,LTJX https://www.utsource.net/itm/p/12541491.html

Parameter	Symbol	Min	Typical	Max	Unit	Notes
Breakdown Voltage	V(BR)DSS	-	1000	-	V
Continuous Drain Current	ID	-	16	-	A	@ Tc=25°C
Pulse Drain Current	IGM	-	160	-	A	@ Tc=25°C, tp=10μs, duty cycle 1%
Gate-Source Voltage	VGS	-10	0	10	V
Input Capacitance	Ciss	-	3800	-	pF	@ VDS=500V, f=1MHz
Output Capacitance	Coss	-	1400	-	pF	@ VDS=500V, f=1MHz
Reverse Transfer Capacitance	Crss	-	1100	-	pF	@ VDS=500V, f=1MHz
On-State Resistance	RDS(on)	-	0.18	-	Ω	@ VGS=10V, ID=16A
Gate Charge	Qg	-	125	-	nC	@ VDS=500V, VGS=10V, ID=16A
Total Dissipation	PD	-	1600	-	W	@ Tc=25°C, heatsink
Junction Temperature	TJ	-55	-	175	°C
Storage Temperature	TSTG	-55	-	150	°C

Instructions:

1. Handling and Storage:

   • Store in a dry, cool place to prevent moisture damage.
   • Handle with care to avoid mechanical stress or damage to the leads.

2. Mounting:

   • Ensure proper thermal management by using a heatsink if operating at high power levels.
   • Apply thermal paste between the device and heatsink for better heat dissipation.

3. Electrical Connections:

   • Use appropriate wire gauges to handle the current ratings.
   • Ensure all connections are secure and free from corrosion.

4. Operating Conditions:

   • Do not exceed the maximum ratings specified in the table.
   • Monitor the junction temperature to ensure it remains within safe limits.

5. Testing:

   • Use a suitable power supply and testing equipment to verify the performance.
   • Follow safety guidelines when working with high voltages and currents.

6. Soldering:

   • Preheat the PCB to reduce thermal shock.
   • Use a soldering iron with a temperature control to avoid overheating the component.

7. Troubleshooting:

   • If the device fails, check for short circuits, incorrect wiring, or excessive temperatures.
   • Refer to the datasheet for detailed troubleshooting steps and contact the manufacturer for further assistance.

(For reference only)