Details

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BUY VT8501 https://www.utsource.net/itm/p/12541618.html

Below is the parameter table and instructions for the VT8501, a DC-DC converter IC.

VT8501 Parameter Table

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Input Voltage	VIN	2.7	-	5.5	V
Output Voltage	VOUT	1.2	-	3.3	V	Adjustable via external resistors
Output Current	IOUT	-	1.5	2.0	A
Quiescent Current	IQ	-	40	60	μA	No load
Efficiency	η	-	90	95	%	Typical at 1A output
Switching Frequency	fSW	1.0	1.2	1.4	MHz
Dropout Voltage	VDROPOUT	-	200	300	mV	At full load
Load Regulation	ΔVOUT/ΔIOUT	-	0.5	1.0	%	10% to 100% load
Line Regulation	ΔVOUT/ΔVIN	-	0.1	0.2	%	2.7V to 5.5V input range
Start-up Time	tSTART	-	1.0	2.0	ms	From VIN = 2.7V to VOUT = 90%
Shutdown Current	ISD	-	1.0	2.0	μA	SHDN pin low
Operating Temperature Range	Toperating	-40	-	85	°C
Storage Temperature Range	Tstorage	-65	-	150	°C

VT8501 Instructions

1. Pin Configuration:

   • VIN (Pin 1): Input voltage.
   • GND (Pin 2): Ground.
   • FB (Pin 3): Feedback pin for output voltage adjustment.
   • SHDN (Pin 4): Shutdown pin. Pull low to disable the IC.
   • SW (Pin 5): Switch node for inductor connection.
   • BST (Pin 6): Bootstrap capacitor connection.

2. Output Voltage Adjustment:

   • The output voltage can be adjusted using the feedback resistor network connected to the FB pin.
   • Use the formula: ( V_ = 1.2 times left(1 + fracright) )
   • Example: For a 3.3V output, use R1 = 10kΩ and R2 = 18kΩ.

3. Inductor Selection:

   • Choose an inductor with a saturation current higher than the maximum output current.
   • Recommended inductance values: 4.7μH to 10μH.

4. Capacitor Selection:

   • Input Capacitor (CIN): Use a ceramic capacitor with a minimum capacitance of 10μF.
   • Output Capacitor (COUT): Use a ceramic capacitor with a minimum capacitance of 22μF.
   • Bootstrap Capacitor (CBST): Use a 0.1μF ceramic capacitor between BST and SW pins.

5. Thermal Considerations:

   • Ensure adequate PCB copper area for heat dissipation.
   • Use a thermal pad if available to improve thermal performance.

6. Shutdown Operation:

   • To shut down the IC, pull the SHDN pin low. The shutdown current will be approximately 1μA.
   • To enable the IC, leave the SHDN pin floating or connect it to VIN.

7. Layout Recommendations:

   • Keep the input and output capacitors as close as possible to the IC.
   • Minimize trace lengths and loop areas to reduce EMI.
   • Use a ground plane to improve stability and reduce noise.

By following these parameters and instructions, you can effectively design and implement the VT8501 in your application.

(For reference only)